Preparation method for multi-layer metal oxide porous film nano gas-sensitive material

US9816176B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9816176-B2
Application numberUS-201415030893-A
CountryUS
Kind codeB2
Filing dateApr 8, 2014
Priority dateOct 21, 2013
Publication dateNov 14, 2017
Grant dateNov 14, 2017

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  1. Title

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  2. Abstract

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  5. First independent claim

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Abstract

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The present invention discloses a method for preparing a multilayer metal oxide nano-porous thin film gas sensitive material, in which the microsphere aqueous solution is self-assembled on a substrate covered with an insulating layer, to form a compact single-layer array template; the surface of these microspheres are etched by using a plasma etching method to reduce the pitches between the microspheres; the metal oxide thin film is deposited by a physical deposition method; the template is removed by ultrasonic treatment with a solvent to prepare a porous array metal oxide thin film; and annealing is performed in air atmosphere to obtain the metal oxide porous thin film gas sensitive material. The present invention can be used for preparing a regular porous array thin film gas sensitive material; the pore size of the prepared porous thin film material is uniform and controllable; and the combination of these materials is controllable.

First claim

Opening claim text (preview).

What is claimed is: 1. A method for preparing a multilayer metal oxide nano-porous film gas sensitive material, comprising the following steps: Step 1-self-assembling the polystyrene microsphere single-layer template on a Si substrate covered with SiO 2 by using a solution evaporation method; Step 2-etching the polystyrene microsphere template by using a reactive ion etching method, to reduce the pitches between PSs; Step 3-depositing, on the substrate processed in Step 2, 40 nm Cu 2 O+40 nm In 2 O 3 with indium oxide being in the bottom layer, and cuprous oxide being in the top layer, 40 nm In 2 O 3 +40 nm Cu 2 O with cuprous oxide being in the bottom layer, and indium oxide being in the top layer, 30 nm Cu 2 O+20 nm In 2 O 3 , +30 nm Cu 2 O with indium oxide being in the intermediate layer, and 30 nm In 2 O 3 +20 nm Cu 2 O+30 nm In 2 O 3 with cuprous oxide being in the intermediate layer, using a magnetron sputter physical deposition method; and Step 4-placing the processed substrate of step 3 in toluene for ultrasonic treatment to remove the polystyrene microsphere template, and performing annealing for 4 h in air atmosphere at the temperature of 550° C. 2. The method for preparing a multilayer metal oxide nano-porous film gas sensitive material according to claim 1 , wherein the thickness of SiO 2 in Step 1 is between 100 nm and 10 μm. 3. The method for preparing a multilayer metal oxide nano-porous film gas sensitive material according to claim 1 , wherein in Step 2, the flow rate of the fed plasma gas O 2 is controlled to be 40 sccm, the pressure in the reaction cavity is controlled to be 37 mTorr, the power applied to excite the O 2 plasma is controlled to be 90 W, and the O 2 plasma etching time is controlled to be 1 min. 4. The method for preparing a multilayer metal oxide nano-porous film gas sensitive material according to claim 1 , wherein in Step 3, the target material used for magnetron sputtering is a ceramics target material of indium oxide or cuprous oxide, the power for exciting the Ar plasma is 80 W, and the pressure in the cavity is 3 mTorr.

Assignees

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Classifications

  • of zinc, germanium, cadmium, indium, tin, thallium or bismuth · CPC title

  • of copper or solid solutions thereof · CPC title

  • C23C14/352Primary

    using more than one target (C23C14/56 takes precedence) · CPC title

  • G01N27/127Primary

    comprising nanoparticles · CPC title

  • Nanotechnology for interacting, sensing or actuating, e.g. quantum dots as markers in protein assays or molecular motors · CPC title

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What does patent US9816176B2 cover?
The present invention discloses a method for preparing a multilayer metal oxide nano-porous thin film gas sensitive material, in which the microsphere aqueous solution is self-assembled on a substrate covered with an insulating layer, to form a compact single-layer array template; the surface of these microspheres are etched by using a plasma etching method to reduce the pitches between the mic…
Who is the assignee on this patent?
Univ Soochow
What technology area does this patent fall under?
Primary CPC classification C23C14/352. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue Nov 14 2017 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).