MN doped SN-base solder alloy and solder joints thereof with superior drop shock reliability

Patent metadata

Field	Value
Publication number	US-9175368-B2
Application number	US-201213542586-A
Country	US
Kind code	B2
Filing date	Jul 5, 2012
Priority date	Dec 13, 2005
Publication date	Nov 3, 2015
Grant date	Nov 3, 2015

Abstract

A Sn—Ag—Cu-based lead-free solder alloy and solder joints thereof with superior drop shock reliability are disclosed. The solder contains between greater than 0 wt. % and less than or equal to about 1.5 wt. % Ag; between greater than or equal to about 0.7 wt. % and less than or equal to about 2.0 wt. % Cu; between greater than or equal to about 0.001 and less than or equal to about 0,2 wt. % Mn; and a remainder of Sn.

First claim

The invention claimed is:

1. A solder, consisting of:
between 0.3 wt. % and 0.7 wt. % Ag;
between 0.7 wt. % and 1.5 wt. % Cu;
between 0.001 wt. % and 0.09 wt. % Mn; and
a remainder of Sn.

2. The solder of claim 1 , further consisting of:
less than or equal to 1.2 wt. % Cu.

3. The solder of claim 1 , further consisting of:
between 0.47 wt. % and 0.56 wt. % Ag;
between 0.8 wt. % and 1.1 wt. % Cu;
between 0.03 and 0.08 wt. % Mn; and
a remainder of Sn.

4. The solder of claim 1 , consisting of:
about 0.5 wt. % Ag;
about 1.0 wt. % Cu;
about 0.05 wt. % Mn; and
a remainder of Sn.

5. The solder of claim 1 , consisting of:
about 0.5 wt. % Ag;
about 1.0 wt. % Cu;
between 0.03 wt. % Mn and 0.08 wt. % Mn; and
a remainder of Sn.

6. The solder of claim 1 , wherein the solder is in the form of a solder ball.

7. The solder of claim 1 , wherein the solder is in the form of a solder paste, and further comprising a flux.

8. The solder of claim 1 , wherein the solder is in the form of a solder powder.

9. The solder of claim 1 , wherein the solder is in the form of a solder joint.

10. The solder of claim 9 , wherein the solder joint is disposed in a mobile device.

11. The solder of claim 1 , further consisting of:
between 0.002 wt. % and 0.09 wt. % Mn.

12. The solder of claim 1 , further consisting of:
between 0.003 wt. % and 0.09 wt. % Mn.

13. The solder of claim 1 , further consisting of:
between 0.01 wt. % and 0.09 wt. % Mn.

14. A solder consisting of:
about 0.5 wt. % Ag;
about 1.0 wt. % Cu;
about 0.05 wt. % Mn; and
a remainder of Sn.

15. A solder consisting of:
between 0.3 wt. % and 0.7 wt. % Ag;
between 0.8 wt. % and 1.1 wt. % Cu;
between 0.03 wt. % and 0.08 wt. % Mn; and
a remainder of Sn.

Assignees

• Liu Weiping
• Lee Ning-Cheng
• Indium Corp

Inventors

• Liu Weiping
• Lee Ning-Cheng

Classifications

• C22C13/00 Primary

  Alloys based on tin · CPC title

• C22C13/02

  with antimony or bismuth as the next major constituent · CPC title

• B23K35/262

  Sn as the principal constituent · CPC title

• Y10T403/479

  Cross-Sectional Technologies · mapped topic

• B23K35/0244

  Powders, particles or spheres; Preforms made therefrom · CPC title