Solder Alloy, Solder Paste, Solder Ball, Solder Preform, Solder Joint, Vehicle-Mounted Electronic Circuit, ECU Electronic Circuit, Vehicle-Mounted Electronic Circuit Device, and ECU Electronic Circuit Device
US-2024238914-A1 · Jul 18, 2024 · US
Connection structure
US9105987B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9105987-B2 |
| Application number | US-201313917706-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jun 14, 2013 |
| Priority date | Feb 9, 2011 |
| Publication date | Aug 11, 2015 |
| Grant date | Aug 11, 2015 |
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- Title
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Abstract
Official abstract text for this publication.
A connection structure that includes a region where at least a Cu—Sn intermetallic compound, a M-Sn intermetallic compound and a Cu-M-Sn intermetallic compound (where M is Ni and/or Mn) exist in a cross-section of a connecting part when the cross-section of the connecting part is analyzed with a WDX. Further, the connection structure is configured so that when the cross-section of the connecting part is evenly divided into ten sections in a vertical direction and a lateral direction, respectively, to form 100 segmentalized squares in total, a ratio of the number of squares in which two or more kinds of intermetallic compounds having different constituent elements exist to the number of all the squares, except for squares in which only a Sn-based metal component exists, is 70% or more.
First claim
Opening claim text (preview).
The invention claimed is: 1. A connection structure in which a first connecting object is connected to a second connecting object, the connection structure comprising: a connecting part interposed between the first connecting object and the second connecting object, the connecting part having at least a Cu—Sn intermetallic compound, a M-Sn intermetallic compound and a Cu-M-Sn intermetallic compound existing in a cross-section of the connecting part when the cross-section of the co…
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Electricity · mapped topic
Electricity · mapped topic
Operations & Transport · mapped topic
Operations & Transport · mapped topic
Chemistry & Metallurgy · mapped topic
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Frequently asked questions
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- What does patent US9105987B2 cover?
- A connection structure that includes a region where at least a Cu—Sn intermetallic compound, a M-Sn intermetallic compound and a Cu-M-Sn intermetallic compound (where M is Ni and/or Mn) exist in a cross-section of a connecting part when the cross-section of the connecting part is analyzed with a WDX. Further, the connection structure is configured so that when the cross-section of the connectin…
- Who is the assignee on this patent?
- Murata Manufacturing Co
- What technology area does this patent fall under?
- Primary CPC classification B23K35/0244. Mapped technology areas include Operations & Transport.
- When was this patent published?
- Publication date Tue Aug 11 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).