Lead-free solder alloys and solder joints thereof with improved drop impact resistance
US-9260768-B2 · Feb 16, 2016 · US
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Lee Ning-Cheng patents
Lee Ning-Cheng holds 5 patents in our database, with recent filings and technology areas summarized below.
| Metric | Value |
|---|---|
| Total patents | 5 |
| Recent patents | 0 |
| First publication | Apr 28, 2015 |
| Latest publication | Feb 16, 2016 |
Filing trend
Year-over-year patent counts for this assignee.
Recent patents
Latest publications where this party is an assignee.
Metal coating for indium bump bonding
US-9190377-B2 · Nov 17, 2015 · US
MN doped SN-base solder alloy and solder joints thereof with superior drop shock reliability
US-9175368-B2 · Nov 3, 2015 · US
Heat dissipating paint with high thermal radiating capability
US-9120930-B2 · Sep 1, 2015 · US
Mixed alloy solder paste
US-9017446-B2 · Apr 28, 2015 · US
Notable patents
Representative or frequently cited publications from precomputed assignee stats.
Lead-free solder alloys and solder joints thereof with improved drop impact resistance
US-9260768-B2 · Feb 16, 2016 · US
Metal coating for indium bump bonding
US-9190377-B2 · Nov 17, 2015 · US
MN doped SN-base solder alloy and solder joints thereof with superior drop shock reliability
US-9175368-B2 · Nov 3, 2015 · US
Heat dissipating paint with high thermal radiating capability
US-9120930-B2 · Sep 1, 2015 · US
Mixed alloy solder paste
US-9017446-B2 · Apr 28, 2015 · US
Technology areas
Mapped technology topics for this assignee.
| Technology | Patents |
|---|---|
| Chemistry & Metallurgy | 4 |
| Operations & Transport | 2 |
| Electricity | 2 |
| Cross-Sectional Technologies | 2 |