Semiconductor wafer mounting method and semiconductor wafer mounting apparatus

Patent metadata

Field	Value
Publication number	US-9159598-B2
Application number	US-201213454477-A
Country	US
Kind code	B2
Filing date	Apr 24, 2012
Priority date	May 27, 2011
Publication date	Oct 13, 2015
Grant date	Oct 13, 2015

Abstract

A workpiece is unloaded from a wafer-receiving container. A first discriminating sensor detects a front surface of the workpiece, and determines either a semiconductor wafer or a spacer is the workpiece. Where the workpiece is a wafer, the first discriminating sensor also determines whether or not a protective tape is on the front surface of the workpiece. Where it is determined that a protective tape is not on the front surface, a second discriminating sensor detects a back surface of the wafer for discriminating the presence or absence of the protective tape.

First claim

What is claimed is:

1. A semiconductor wafer mounting method for mounting a semiconductor wafer on a ring frame via a supporting adhesive tape, comprising:
prior to generating a mount frame having the ring frame integrate with the semiconductor via the adhesive tape,
(A) discriminating a carrying-out object between the semiconductor wafer and a spacer;
(B) discriminating a protective tape from the semiconductor wafer; and
(C) discriminating a circuit surface of the semiconductor wafer;
wherein (B) is performed in accordance with the result of (A), (C) is performed in accordance with the result of (B), and (A) to (C) are performed as follows:
(a) during transportation of the carrying-out object as the semiconductor wafer and the carrying-out object as the spacer that are alternately stacked in a receiving container by a transport mechanism, detecting a front surface of the carrying-out object by a first discrimination sensor and discriminating the carrying-out object between the semiconductor wafer and the spacer in accordance with a detection result, thereby performing (A);
(b-1) determining whether or not a protective tape is on the front surface of the semiconductor wafer by detecting the front surface of the semiconductor wafer with a first discrimination sensor, and
(b-2) when it is determined that the protective tape is not on the front surface of the semiconductor wafer, detecting a back surface of the semiconductor wafer with a second discrimination sensor to determine whether or not the protective tape is on the back surface of the semiconductor wafer, thereby performing (B), and
(c) when it is determined from the detection performed in (B) by the second discrimination sensor that the protective tape is not on the back surface of the semiconductor wafer,
comparing the detection results of the front and back surfaces of the semiconductor wafer and determining a circuit surface thereof, thereby performing (C);

(D) after performing (A) to (C), placing the semiconductor wafer having the surface with the protective tape or the circuit surface directed downward by the transport mechanism onto an alignment stage and aligning the semiconductor wafer with the alignment stage,
(E) joining the supporting adhesive tape over both the surface of the semiconductor wafer that is directed upward and the ring frame with a tape joining mechanism,
(F) reversing the semiconductor wafer with the protective tape, placing the semiconductor wafer on a holding table by the transport mechanism, and separating the protective tape from the semiconductor wafer with a separating mechanism;
(G) collecting only the mount frame from which the protective tape is separated; and
(H) transporting the spacer discriminated in (A) into a spacer-collecting section by the transport mechanism.

2. The semiconductor wafer mounting method according to claim 1 , further comprising:
disposing the first discriminating sensor above the receiving container and detecting the front surface of the carrying-out object during lifting up the semiconductor wafer from the receiving container by the transport mechanism; and
disposing the second discriminating sensor adjacent to an outer periphery of the receiving container and detecting the back surface of the semiconductor wafer through horizontal movement of the transport mechanism.

3. The semiconductor wafer mounting method according to claim 1 , wherein
the spacer has permeability, and
wherein, when it is determined that the protective tape is not on the semiconductor wafer;
the semiconductor water is returned to the receiving container, and a spacer is unloaded from the spacer collecting section by the transport mechanism and is transported to a joining position of the adhesive tape,
the semiconductor wafer is unloaded from the receiving container by the transport mechanism, is placed on the spacer with the circuit surface of the aligned semiconductor wafer being directed downward, and the adhesive tape is joined over both the ring frame and the surface of the semiconductor wafer that is directed upward to manufacture a mount frame, and
the manufactured mount frame is carried out, and then the spacer is unloaded and transported into the spacer-collecting section.

4. The semiconductor wafer mounting method according to claim 1 , wherein
the first discriminating sensor determines a cushioning material on the bottom of the receiving container, and
the transport mechanism returns the cushioning material to the receiving container when it is determined that the carrying-out object is the cushioning.

Assignees

• Yamamoto Masayuki
• Okuno Chouhei
• Nitto Denko Corp

Inventors

• Yamamoto Masayuki
• Okuno Chouhei

Classifications

• H10P72/0442 Primary

  Apparatus for placing on an insulating substrate, e.g. tape · CPC title

• B29C65/50

  using adhesive tape {, e.g. thermoplastic tape; using threads or the like (B29C65/3444 takes precedence)} · CPC title

• H01L21/67132 Primary

  Electricity · mapped topic

• H10W72/071 Primary

  Connecting or disconnecting · CPC title