Rapid Thermal Processing System With Cooling System
US-2024379390-A1 · Nov 14, 2024 · US
US8933376B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-8933376-B2 |
| Application number | US-1519108-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jan 16, 2008 |
| Priority date | Jan 17, 2007 |
| Publication date | Jan 13, 2015 |
| Grant date | Jan 13, 2015 |
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A heating device has a heating chamber 3 . An initial temperature distribution is created in a surface of a substrate (wafer W) when the substrate is carried into the heating chamber 3 . . . Temperature distribution creating means (heating lamps 2 ) creates a preheating temperature distribution in the substrate supported on a cooling plate 4 at a waiting position before the substrate is carried into the heating chamber 3 so as to level out the initial temperature distribution.
Opening claim text (preview).
What is claimed is: 1. A heating device comprising: a heating chamber contained in a processing vessel for heating and processing, and provided with heating plates for heating a substrate; a carrier device which transversely carries a substrate placed at a waiting position positioned at a neighboring side of the heating chamber and outside the heating chamber into the heating chamber in the processing vessel, the carrier device carrying the substrate in a direction from a front…
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