Jet soldering apparatus

Patent metadata

Field	Value
Publication number	US-2025375827-A1
Application number	US-202318874549-A
Country	US
Kind code	A1
Filing date	Jun 12, 2023
Priority date	Jun 13, 2022
Publication date	Dec 11, 2025
Grant date	—

Abstract

A jet soldering apparatus 100 has a storage tank 110 configured to store molten solder; a supply port 125, 135 for supplying the molten solder to a substrate 200 ; and a cooling unit 310, 330 that is positioned on a downstream side of the supply port 125, 135 in a conveyance direction of the substrate 200 , is provided at an upper position of the storage tank 110 , and is configured to supply gas.

First claim

1 . A jet soldering apparatus comprising:
a storage tank configured to store molten solder; a supply port for supplying the molten solder to a substrate; and a cooling unit that is positioned on a downstream side of the supply port in a conveyance direction of the substrate, is provided at an upper position of the storage tank, and is configured to supply gas,
wherein the cooling unit has a slit-shaped first supply port for supplying the gas and a second supply port including a plurality of openings or nozzles for supplying the gas.

2 . The jet soldering apparatus according to claim 1 ,
wherein the cooling unit has a lower cooling unit configured to supply the gas from below to the substrate conveyed, and an upper cooling unit configured to supply the gas from upper to the substrate conveyed.

3 . The jet soldering apparatus according to claim 2 ,
wherein the lower cooling unit is positioned on a downstream side of the upper cooling unit in the conveyance direction of the substrate.

4 . The jet soldering apparatus according to claim 1 , wherein the cooling unit supplies the gas toward a downstream side of the conveyance direction of the substrate.

5 . The jet soldering apparatus according to claim 4 ,
wherein the cooling unit has a lower cooling unit configured to supply the gas from below to the substrate conveyed, and an upper cooling unit configured to supply the gas from upper to the substrate conveyed, wherein the upper cooling unit supplies the gas toward obliquely downward along the conveyance direction of the substrate, and wherein the lower cooling unit supplies the gas toward obliquely upward along the conveyance direction of the substrate.

6 . The jet soldering apparatus according to claim 1 , wherein the cooling unit has a first cooling unit for cooling the solder supplied to the substrate, and a second cooling unit for cooling the substrate.

7 . The jet soldering apparatus according to claim 1 , wherein the cooling unit supplies air at a room temperature as the gas.

8 . The jet soldering apparatus according to claim 1 ,
wherein the supply port has a first supply port for supplying the molten solder provided at a first housing, and a second supply port for supplying the molten solder provided at a second housing, and
wherein a part where the molten solder falls is not provided between the first supply port and the second supply port along the conveyance direction of the substrate.

9 . The jet soldering apparatus according to claim 1 comprising a measurement unit that measures a temperature of the substrate after being cooled by the cooling unit.

10 . The jet soldering apparatus according to claim 9 comprising a display unit that displays the temperature of the substrate measured by the measurement unit.

11 . The jet soldering apparatus according to claim 9 ,
wherein when the temperature of the substrate measured by the measurement unit is out of a predetermined temperature range, a signal is transmitted for stopping a carry-in of the substrate.

12 . The jet soldering apparatus according to claim 9 comprising a notification unit that notifies that the temperature of the substrate is out of a predetermined temperature range when the temperature of the substrate measured by the measurement unit is out of the predetermined temperature range.

13 . The jet soldering apparatus according to claim 1 comprising a return part configured to allow the gas supplied from the first supply port to flow toward the downstream side in the conveyance direction of the substrate.

14 . The jet soldering apparatus according to claim 1 , wherein the cooling unit has a slit-shaped first lower supply port for supplying the gas from below to the substrate conveyed, and a second lower supply port including a plurality of openings or nozzles for supplying the gas from below to the substrate conveyed, or has a slit-shaped first upper supply port for supplying the gas from above to the substrate conveyed, and a second upper supply port including a plurality of openings or nozzles for supplying the gas from above to the substrate conveyed.

15 . A jet soldering apparatus comprising:
a storage tank configured to store molten solder; a supply port for supplying the molten solder to a substrate; and a cooling unit that is positioned on a downstream side of the supply port in a conveyance direction of the substrate, is provided at an upper position of the storage tank, and is configured to supply gas,
wherein the cooling unit has a lower cooling unit that has a second supply port including a plurality of openings or nozzles and supplies the gas from below to the substrate conveyed, and an upper cooling unit that has a slit-shaped first supply port and supplies the gas from above to the substrate conveyed.

Assignees

• Senju Metal Industry Co

Inventors

• Kawashima Yasuji
• Taguchi Hiroshi
• Kuramoto Kyoko
• HANZAWA Henri
• Kagaya Tomotake
• Ichikawa Hirokazu
• Shinohara Katsuhiro

Classifications

• B23K3/0638

  for viscous material feeding, e.g. solder paste feeding (B23K3/0623 takes precedence) · CPC title

• H05K3/3468

  Application of molten solder, e.g. dip soldering · CPC title

• B23K3/085 Primary

  Cooling, heat sink or heat shielding means · CPC title

• B23K3/0607

  Solder feeding devices · CPC title

• B23K1/203

  Fluxing, i.e. applying flux onto surfaces · CPC title