Gas-intake-port array structure and soldering apparatus

Patent metadata

Field	Value
Publication number	US-9511379-B2
Application number	US-201314654939-A
Country	US
Kind code	B2
Filing date	Dec 20, 2013
Priority date	Dec 28, 2012
Publication date	Dec 6, 2016
Grant date	Dec 6, 2016

Abstract

In a gas-intake-port array structure, which enables any temperature fluctuation during conveying time of a printed circuit board, a semiconductor wafer or the like to be reduced and allows the printed circuit board and the like to be very uniformly heated or cooled, a nozzle pattern P 2 is arranged to be line symmetry with a nozzle pattern P 1 in one upper or lower divided section of a nozzle layout region of the nozzle cover 3 relative to a center portion that is orthogonal to a conveying direction, as shown in FIG. 1 . In order for the arrangement patterns diagonally arranged in the nozzle layout region to become identical, the nozzle pattern P 1 is arranged to be line symmetry with the nozzle pattern P 2 in the other upper or lower divided section. Intake ports 3 b, 3 c and 3 d each having a predetermined opening width are arranged between two blowing nozzles 2 or more and across a first row thereof and plural other rows having different phases, in order to circulate the gas blown from the blowing nozzles 2 . Widths of the intake ports 3 b, 3 c and 3 d are set so that they are gradually become narrower with increasing distance from the center portion.

First claim

The invention claimed is:

1. A gas-intake-port array structure of a gas-blowing-holes plate in a soldering apparatus for performing soldering by discharging gas from plural gas-blowing holes arranged in the gas-blowing-holes plate and blowing the gas to a board to be soldered while a conveyed member, which mounts the board, is conveyed, comprising:
the gas-blowing-holes plate having a predetermined nozzle layout region;
wherein the nozzle layout region is divided into four divided sections;
wherein in an arrangement pattern of the gas-blowing holes arranged in one of the divided sections:
a first row is formed so that first and second gas-blowing holes are arranged with a predetermined opening width pitch along a direction that is orthogonal to a conveying direction of the conveyed member,
plural other rows are formed with a predetermined row arrangement pitch along the conveying direction with them being parallel to the first row,
the first gas-blowing hole in every other row is arranged with a predetermined space along a width direction from the first gas-blowing hole in every other row; and
the first gas-blowing holes in the first row and other rows have such a configuration that they have different phases from each other on the orthogonal direction;

wherein in the divided sections of upper and lower opposite sides relative to a center portion of the nozzle layout region in which the width direction and the conveying direction are orthogonal to each other, a first arrangement pattern of the gas-blowing holes and a second arrangement pattern of the gas-blowing holes, which is an inverse first arrangement pattern thereof, are provided so that the arrangement patterns that are arranged on a diagonal line in the nozzle layout region are identical; and wherein gas intake oval ports each having a predetermined opening width for circulating the gas blown from the gas-blowing holes are arranged between the first and second gas-blowing holes and across the first row and the plural other rows having different phases and the opening widths of the oval ports are formed so as to be gradually narrower with increasing distance from the center portion.

2. The gas-intake-port array structure according to claim 1 wherein the gas-intake oval ports are arranged like V shape and inverse V shape in upper and lower divided sections of the nozzle layout region.

3. The gas-intake-port array structure according to claim 1 wherein each of the gas-blowing holes includes crisscross opening in a forward end thereof.

4. In a gas-intake-port array structure of a gas-blowing-holes plate in a soldering apparatus for performing soldering by discharging gas from plural gas-blowing holes arranged in the gas-blowing-holes plate and blowing the gas to a board to be soldered while a conveyed member, which mounts the board, is conveyed, the soldering apparatus is provided with the gas-blowing-holes plate having the gas-intake-port array structure claimed in claim 1 .

Assignees

• Senju Metal Industry Co

Inventors

• Hiyama Tsutomu

Classifications

• B23K1/008 Primary

  Soldering within a furnace (B23K1/012 takes precedence) · CPC title

• F27B9/10

  heated by hot air or gas · CPC title

• H05K3/3494

  Heating processes for reflow soldering · CPC title

• B23K1/0016

  Soldering of electronic components · CPC title

• B05B1/005 Primary

  Nozzles or other outlets specially adapted for discharging one or more gases · CPC title