Workpiece holder, wafer chuck, wafer holding method
US-2025201621-A1 · Jun 19, 2025 · US
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Patent family 76858258
This patent family groups 5 related publications across US. Members often share priority claims or equivalent filings in different countries.
| Field | Value |
|---|---|
| Family ID | 76858258 |
| Family type | — |
| Earliest priority | Jan 19, 2020 |
| First filing country | US |
| Member publications | 5 |
| Countries | US |
| Representative publication | US2025201621A1 — Workpiece holder, wafer chuck, wafer holding method |
Representative publication
Best representative member for this family based on priority and filing country.
US2025201621A1 — Workpiece holder, wafer chuck, wafer holding method (published Jun 19, 2025)
Member publications
Related publications in this family.
Method of manufacturing semiconductor package, method of handling wafer, and method of handling workpiece
US-12266559-B2 · Apr 1, 2025 · US
Method of manufacturing semiconductor package, method of handling wafer, and method of handling workpiece
US-2023369094-A1 · Nov 16, 2023 · US
Workpiece holder, wafer chuck, wafer holding method
US-11791192-B2 · Oct 17, 2023 · US
Workpiece holder, wafer chuck, wafer holding method
US-2021225684-A1 · Jul 22, 2021 · US