Electrostatic chucks with self-sealing gas conduits and/or reduced clogging due to residue

Patent metadata

Field	Value
Publication number	US-2025062149-A1
Application number	US-202218721910-A
Country	US
Kind code	A1
Filing date	Dec 15, 2022
Priority date	Dec 22, 2021
Publication date	Feb 20, 2025
Grant date	—

Abstract

An electrostatic chuck for a substrate includes a baseplate including a first surface and a cavity arranged on the first surface. A top plate includes a first plug. A first spring member is arranged in the cavity. A second plug is arranged between the top plate and the first spring member. A bonding material attaches the top plate to the first surface of the baseplate.

First claim

1 . An electrostatic chuck for a substrate, comprising:
a baseplate including a first surface and a cavity arranged on the first surface; a top plate including a first plug; one or more spring members including a first spring member arranged in the cavity; a second plug arranged between the top plate and the first spring member; and a bonding material attaching the top plate to the first surface of the baseplate.

2 . The electrostatic chuck of claim 1 , wherein the first spring member biases the second plug into direct contact with a second surface of the top plate and wherein the top plate, the first plug and the second plug are made of ceramic.

3 . The electrostatic chuck of claim 1 , further comprising a gasket arranged around the cavity between the top plate and the baseplate, wherein the bonding material is located radially outside of the gasket.

4 . The electrostatic chuck of claim 1 , wherein the first plug is made of porous ceramic and is formed insitu in the top plate.

5 . The electrostatic chuck of claim 1 , wherein the second plug is made of porous ceramic.

6 . The electrostatic chuck of claim 1 , wherein the second plug has a diameter that is greater than a diameter of the first plug.

7 . The electrostatic chuck of claim 1 , wherein the second plug includes an annular outer channel formed on a radially outer surface thereof to receive the bonding material.

8 . The electrostatic chuck of claim 1 , wherein the second plug is made of porous ceramic and does not include a gas through-hole.

9 . The electrostatic chuck of claim 1 , wherein the second plug is made of porous ceramic and includes a gas through-hole that extends partially through the second plug.

10 . The electrostatic chuck of claim 1 , wherein the second plug is made of porous ceramic and includes a gas through-hole that extends through the second plug.

11 . The electrostatic chuck of claim 1 , wherein the second plug includes a cylindrical body with a radially outer portion made of non-porous ceramic and a radially inner portion made of porous ceramic.

12 . The electrostatic chuck of claim 1 , further comprising a sleeve arranged between the second plug and side surfaces of the cavity.

13 . The electrostatic chuck of claim 12 , further comprising a second spring member arranged in the cavity to bias the sleeve against the top plate.

14 . The electrostatic chuck of claim 12 , wherein the second plug is made of porous ceramic.

15 . The electrostatic chuck of claim 12 , wherein the sleeve is made of ceramic.

16 . A method of making an electrostatic chuck for a substrate, comprising:
providing a baseplate including a first surface and a cavity arranged on the first surface; providing a top plate including a first plug; arranging a first spring member in the cavity; arranging a second plug between the top plate and the first spring member; and attaching the top plate to the first surface of the baseplate using a bonding material.

17 . The method of claim 16 , further comprising biasing the second plug into direct contact with a second surface of the top plate using the first spring member, wherein the top plate, the first plug and the second plug are made of ceramic.

18 . The method of claim 16 , further comprising arranging a gasket around the cavity between the top plate and the baseplate prior to using the bonding material.

19 . The method of claim 16 , further comprising forming the first plug insitu in the top plate, wherein the first plug is made of porous ceramic.

20 . The method of claim 16 , wherein the second plug is made of porous ceramic.

21 . The method of claim 16 , wherein the second plug has a diameter that is greater than a diameter of the first plug.

22 . The method of claim 16 , further comprising forming an annular channel on a radially outer surface of the second plug to receive the bonding material.

23 . The method of claim 16 , wherein the second plug is made of porous ceramic and does not include a gas through-hole.

24 . The method of claim 16 , wherein the second plug is made of porous ceramic and includes a gas through-hole extending partially through the second plug.

25 . The method of claim 16 , wherein the second plug is made of porous ceramic and includes a gas through-hole extending through the second plug.

26 . The method of claim 16 , wherein the second plug includes a cylindrical body with a radially outer portion made of non-porous ceramic and a radially inner portion made of porous ceramic.

27 . The method of claim 16 , further comprising arranging a sleeve between the second plug and side surfaces of the cavity.

28 . The method of claim 27 , further comprising biasing the sleeve against the top plate using a second spring member.

29 . The method of claim 27 , wherein the second plug is made of porous ceramic.

30 . The method of claim 27 , wherein the sleeve is made of ceramic.

31 . An electrostatic chuck for a substrate, comprising:
a baseplate including a first surface and a cavity arranged on the first surface, wherein the cavity includes a first cavity portion defining a first annular surface and a second cavity portion defining a second annular surface; a top plate including a first plug; a first spring member arranged on the first annular surface in the first cavity portion; a second plug arranged on the second annular surface between the top plate and the second annular surface; a sleeve arranged around the second plug and on the first spring member; and a bonding material attaching the top plate to the first surface of the baseplate.

32 . The electrostatic chuck of claim 31 , wherein the first spring member biases a top surface of the sleeve into direct contact with a bottom surface of the top plate.

33 . The electrostatic chuck of claim 31 , further comprising a gasket arranged around the cavity between the top plate and the baseplate, wherein the bonding material is located radially outside of the gasket.

34 . The electrostatic chuck of claim 31 , wherein the first plug is made of porous ceramic and is formed insitu in the top plate.

35 . The electrostatic chuck of claim 31 , wherein the second plug has a diameter that is greater than a diameter of the first plug.

36 . The electrostatic chuck of claim 31 , further comprising bonding material to bond the second plug to side walls of the second cavity portion.

37 . The electrostatic chuck of claim 31 , wherein the second plug is made of porous ceramic and does not include a gas through-hole.

38 . The electrostatic chuck of claim 31 , wherein the second plug is made of porous ceramic and includes a gas through-hole that extends partially through the second plug.

39 . The electrostatic chuck of claim 31 , wherein the second plug is made of porous ceramic and includes a gas through-hole that extends through the second plug.

40 . The electrostatic chuck of claim 31 , wherein the second plug is made of non-porous ceramic and includes a gas through-hole that extends through the second plug.

41 . A method for making an electrostatic chuck for a substrate, comp

Assignees

• Lam Res Corp

Inventors

• Narendrnath Kadthala R
• Behziz Behnam
• Wu Benny
• Purandare Moreshwar Narayan

Classifications

• H10P72/7624

  characterised by the mechanical construction of the susceptor, stage or support · CPC title

• H10P72/7616

  characterised by a coating, a hardness or a material · CPC title

• H10P72/722 Primary

  Details of electrostatic chucks · CPC title

• H10P72/72

  using electrostatic chucks · CPC title

• H10P72/0432

  mainly by conduction · CPC title