In situ real-time sensing and compensation of non-uniformities in substrate processing systems
US-2025069866-A1 · Feb 27, 2025 · US
This page is not indexed by search engines while we improve data quality.
Wu Benny patents
Wu Benny is listed as an inventor on 10 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Wu Benny |
| Total patents | 10 |
| First publication | Dec 22, 2016 |
| Latest publication | Feb 27, 2025 |
Notable patents
Publications ranked by popularity score, then publication date.
Electrostatic chucks with self-sealing gas conduits and/or reduced clogging due to residue
US-2025062149-A1 · Feb 20, 2025 · US
In situ real-time sensing and compensation of non-uniformities in substrate processing systems
US-12142464-B2 · Nov 12, 2024 · US
Substrate supports with multilayer structure including coupled heater zones with local thermal control
US-2023274954-A1 · Aug 31, 2023 · US
In situ real-time sensing and compensation of non-uniformities in substrate processing systems
US-2022277928-A1 · Sep 1, 2022 · US
Multi-plane heater for semiconductor substrate support
US-10690414-B2 · Jun 23, 2020 · US
Auto-correction of electrostatic chuck temperature non-uniformity
US-10381248-B2 · Aug 13, 2019 · US
Detecting partial unclamping of a substrate from an ESC of a substrate processing system
US-10224187-B1 · Mar 5, 2019 · US
Multi-plane heater for semiconductor substrate support
US-2017167790-A1 · Jun 15, 2017 · US
Auto-correction of electrostatic chuck temperature non-uniformity
US-2016372352-A1 · Dec 22, 2016 · US
Recent patents
Latest publications not already listed above.
No data yet.
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Lam Res Corp | 10 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10P72/72 | 9 |
| H10P72/0432 | 7 |
| H10P72/0602 | 6 |
| H01L21/6831 | 6 |
| H01L21/67248 | 5 |