Plasma diagnostic device, and semiconductor processing equipment using the same

Patent metadata

Field	Value
Publication number	US-2025046587-A1
Application number	US-202418636099-A
Country	US
Kind code	A1
Filing date	Apr 15, 2024
Priority date	Aug 3, 2023
Publication date	Feb 6, 2025
Grant date	—

Abstract

The present disclosure relates to plasma diagnostic devices. An example plasma diagnostic device includes a pinhole through which a first optical signal passes, an optical device in which the first optical signal is incident and the first optical signal is converted into a second optical signal, a filter configured to filter the second optical signal and to output a third optical signal of a specific wavelength band, and a sensor configured to monitor a distribution of the first optical signal, the second optical signal, and the third optical signal.

First claim

What is claimed is:

1 . Semiconductor processing equipment comprising:
a chamber including a chamber wall and a wafer support on which the wafer is disposed; at least one view port installed on the chamber wall; and at least one plasma diagnostic device installed in the at least one view port in a center direction of the chamber, wherein the at least one plasma diagnostic device includes a pinhole through which a first optical signal passes, wherein the first optical signal is naturally dispersed from an end of the pinhole, an optical device in which the first optical signal is incident, wherein the optical device is configured to convert the first optical signal into a second optical signal which is parallel light, and to emit the second optical signal, a filter configured to filter the second optical signal and to output a third optical signal of a specific wavelength band, and a sensor configured to monitor a distribution of the first optical signal, the second optical signal, and the third optical signal.

2 . Semiconductor processing equipment of claim 1 , wherein the optical device includes an off-axis-parabolic mirror.

3 . Semiconductor processing equipment of claim 2 , wherein the optical device includes a plane mirror that reflects the second optical signal reflected by the off-axis-parabolic mirror to change a movement direction of the second optical signal.

4 . Semiconductor processing equipment of claim 3 , wherein the optical device includes a relay lens that extends a movement distance of the second optical signal.

5 . Semiconductor processing equipment of claim 4 , wherein the relay lens includes a first lens and a second lens,
wherein the second optical signal passing through the first lens is collected at a convergence point and then incident on the second lens, and the second optical signal passing through the second lens is parallel light, and wherein the plane mirror is disposed at the convergence point to change the movement direction of the second optical signal.

6 . Semiconductor processing equipment of claim 1 , wherein the optical device includes a collimation lens.

7 . Semiconductor processing equipment of claim 6 , wherein the optical device includes a relay lens that extends a movement distance of the second optical signal.

8 . Semiconductor processing equipment of claim 7 , wherein the relay lens includes a first lens and a second lens,
wherein the second optical signal passing through the first lens is collected at a convergence point and then incident on the second lens, and the second optical signal passing through the second lens is parallel light, and wherein the optical device includes a plane mirror disposed at the convergence point to change a movement direction of the second optical signal.

9 . Semiconductor processing equipment of claim 1 , wherein the filter includes a narrow band pass filter.

10 . Semiconductor processing equipment of claim 1 , wherein the pinhole, the optical device, the filter, and the sensor are sequentially arranged.

11 . Semiconductor processing equipment comprising:
a wafer; a chamber including a chamber wall and a wafer support on which the wafer is disposed; at least one view port installed on the chamber wall; at least one plasma diagnostic device installed in the at least one view port in a center direction of the chamber; and a calculation circuit connected to the at least one plasma diagnostic device, wherein the at least one plasma diagnostic device includes a pinhole on which an optical signal is incident, an optical device configured to convert the optical signal naturally dispersed from an end of the pinhole into parallel light, a filter configured to filter a specific wavelength band of the parallel light, and a sensor, and wherein the calculation circuit is configured to calculate an output of the sensor and to output area-specific information of plasma generated in a space inside the chamber.

12 . The semiconductor processing equipment of claim 11 , wherein the at least one plasma diagnostic device is installed outside the chamber wall.

13 . The semiconductor processing equipment of claim 11 , wherein the pinhole and the optical device are installed inside the chamber wall, and
wherein the filter and the sensor are installed outside the chamber wall.

14 . The semiconductor processing equipment of claim 11 , wherein the optical device includes an off-axis-parabolic mirror and a plane mirror, and the plane mirror reflects the optical signal reflected by the off-axis-parabolic mirror to change a movement direction the optical signal.

15 . The semiconductor processing equipment of claim 11 , wherein the optical device includes a collimation lens a relay lens that extends a movement distance of the optical signal.

16 . The semiconductor processing equipment of claim 15 , wherein the relay lens includes a first lens and a second lens,
wherein the optical signal passing through the first lens is collected at a convergence point and then incident on the second lens, and a movement path of the optical signal passing through the second lens is parallel, and wherein the optical device includes a plane mirror disposed at the convergence point to change a movement direction of the optical signal.

17 . The semiconductor processing equipment of claim 11 , wherein the at least one view port includes a first view port and a second view port,
wherein the at least one plasma diagnostic device includes a first plasma diagnostic device installed in the first view port and a second plasma diagnostic device installed in the second view port, and wherein the first view port is disposed in a first direction from a center axis of the chamber, and the second view port is disposed in a second direction perpendicular to the first direction.

18 . The semiconductor processing equipment of claim 11 , wherein the at least one view port includes a first view port and a second view port,
wherein the at least one plasma diagnostic device includes a first plasma diagnostic device installed in the first view port and a second plasma diagnostic device installed in the second view port, and wherein each view port of the first view port and the second view port is disposed in a first direction from a center axis of the chamber.

19 . Semiconductor processing equipment comprising:
a wafer; a chamber including a chamber wall and a wafer support on which the wafer is disposed; at least one view port installed on the chamber wall; at least one plasma diagnostic device installed in the at least one view port in a center direction of the chamber; and a calculation circuit connected to the at least one plasma diagnostic device, wherein the at least one plasma diagnostic device includes a pinhole, an optical device, a filter, and a sensor, wherein the pinhole is configured to emit a first optical signal to the optical device, the optical device is configured to convert the first optical signal into parallel light and to emit the parallel light as a second optical signal, the filter is configured to filter a specific wavelength band of the second optical signal to emit a third optical signal, and the sensor is configured to capture the third optical signal to obtain raw data and to transmit the raw data to the calculation circuit, wherein the raw data includes first raw data obtained by filtering a first specific wavelength band of the second optical signal by the filter and second raw data obtained by filtering a second specific wa

Assignees

• Samsung Electronics Co Ltd

Inventors

• Kim Taehyun
• Kang Chansoo
• Kim Minju
• Kang Daewon
• Sung Dougyong
• Yang Jungmo
• Oh Sejin

Classifications

• H10P72/0604 Primary

  Process monitoring, e.g. flow or thickness monitoring · CPC title

• H01J2237/334

  Etching · CPC title

• H01J2237/3321

  CVD [Chemical Vapor Deposition] · CPC title

• G02B3/02

  with non-spherical faces (G02B3/10 takes precedence) · CPC title

• G02B7/1822

  comprising means for aligning the optical axis (G02B7/1821 takes precedence) · CPC title