Thermal compression bonder nozzle with vacuum relief features

Patent metadata

Field	Value
Publication number	US-2021288021-A1
Application number	US-202117332830-A
Country	US
Kind code	A1
Filing date	May 27, 2021
Priority date	May 27, 2021
Publication date	Sep 16, 2021
Grant date	—

Abstract

An apparatus comprising a bonding nozzle that has one or more channels in a bonding surface. The one or more channels comprise a first channel portion in an inner region of the bonding surface and a second channel portion along an outer periphery of the bonding surface. The one or more channels are in fluid communication with a vacuum port. A vacuum relief conduit within the bonding nozzle comprises a first opening into the second channel portion along the outer periphery of the bonding surface, and a second opening along an exterior wall of the bonding nozzle.

First claim

We claim:

1 . An apparatus, comprising:
a bonding nozzle comprising one or more channels in a bonding surface, the one or more channels comprising a first channel portion in an inner region of the bonding surface and a second channel portion along an outer periphery of the bonding surface, the one or more channels in fluid communication with a vacuum port; and a vacuum relief conduit within the bonding nozzle, the vacuum relief conduit comprising a first opening into the second channel portion along the outer periphery of the bonding surface and a second opening along an exterior wall of the bonding nozzle.

2 . The apparatus of claim 1 , wherein the bonding nozzle has a rectangular periphery, wherein one or more channels of the second channel portion extend along orthogonal edges of the rectangular periphery, and wherein the one or more channels of the second channel portion has a first end and a second end.

3 . The apparatus of claim 2 , wherein a first channel of the second channel portion is joined to a second channel of the second channel portion, wherein the first channel is orthogonal to the second channel.

4 . The apparatus of claim 3 , wherein the vacuum relief conduit is a first vacuum relief conduit and opens into the first channel near the first end, and wherein a second conduit opens into the first channel near the second end.

5 . The apparatus of claim 4 , wherein a third vacuum relief conduit opens into the first channel between the first and second vacuum relief conduits.

6 . The apparatus of claim 1 , wherein a first portion of the vacuum relief conduit is orthogonal to the bonding surface and extends partially within the bonding nozzle, and wherein a second portion of the vacuum relief conduit is substantially parallel to the bonding surface and extends to the exterior wall of the bonding nozzle.

7 . The apparatus of claim 6 , wherein the second portion opens to an ambient atmosphere that surrounds the bonding nozzle.

8 . The apparatus of claim 1 , wherein a central conduit extends from a central region of the bonding surface through the bonding nozzle, wherein a first end of the central conduit is fluidically coupled to the first channel portion and a second end of the central conduit is coupled to the vacuum port on the bonding nozzle.

9 . The apparatus of claim 8 , wherein the first channel portion comprises one or more interior channels extending between the central conduit and the second channel portion, wherein the one or more interior channels is in fluidic communication with the second channel portion.

10 . The apparatus of claim 9 , wherein the one or more interior channels extend between the central conduit and the intersection of a first peripheral channel of the second channel portion and a second peripheral channel of the second channel portion, wherein the first peripheral channel is orthogonal to the second peripheral channel.

11 . A system, comprising:
a thermal compression bonder, the thermal compression bonder comprising: a bonding nozzle comprising one or more channels in a bonding surface, the one or more channels comprising a first channel portion in an inner region of the bonding surface in fluidic communication with a second channel portion along an outer periphery of the bonding surface, the one or more channels in fluid communication with a vacuum port; and a vacuum relief conduit within the bonding nozzle, the vacuum relief conduit comprising a first opening into the second channel portion along the outer periphery of the bonding surface and a second opening along an exterior wall of the bonding nozzle.

12 . The system of claim 11 , wherein the first channel portion is fluidically coupled to the second channel portion and to a central conduit extending between a vacuum port and a central region of the bonding surface, wherein the central conduit is coupled to a vacuum source to create a vacuum within the first and second channel portions when the bonding surface is interfaced to a substrate.

13 . The system of claim 12 , wherein the vacuum relief conduit opens to an ambient atmosphere wherein a vacuum gradient is to be created within the first and second channel portions by metered leakage of the ambient atmosphere through the vacuum relief conduit into the second channel portion when the vacuum port is coupled to the vacuum source, and wherein the vacuum is to be minimal along the periphery of the bonding surface and maximal within the central region of the bonding surface.

14 . A method for using a thermal compression bonder, the method comprising:
interfacing a bonding surface of a bonding nozzle to an integrated circuit (IC) die to be bonded to a substrate, the bonding surface comprising one or more channels, the one or more channels comprising a first channel portion within a central portion of the bonding surface fluidically coupled to a second channel portion along a periphery of the bonding surface; and forming a vacuum gradient within the one or more channels, wherein the vacuum gradient is minimal at the periphery of the bonding surface and maximal within the central portion of the bonding surface.

15 . The method of claim 14 , wherein interfacing the bonding surface of the bonding nozzle to the IC die comprises aligning the second channel portion with the edges of the IC die.

16 . The method of claim 15 , wherein forming a vacuum gradient within the one or more channels comprises coupling a vacuum source to the one or more channels, wherein an ambient atmosphere flows into the one or more channels through at least one vacuum relief conduit in fluidic communication with the second channel portion.

17 . The method of claim 16 , wherein forming a vacuum gradient within the one or more channels comprises providing metered suction of the ambient atmosphere through the at least one vacuum relief conduit such that the second channel portion has a smaller vacuum than the first channel portion.

18 . The method of claim 17 , wherein forming a vacuum gradient within the one or more channels comprises forming a vacuum gradient within the first channel portion that is decreases from the central region of the bonding surface toward the periphery of the bonding surface.

19 . The method of claim 18 , wherein interfacing the bonding surface of the bonding nozzle to the IC die comprises forming a clamping force gradient between the bonding surface and the IC die such that the clamping force is maximal within a central region of the IC die and minimal within a peripheral region of the IC die, and wherein the clamping force gradient is proportional to the vacuum gradient.

20 . The method of claim 19 , wherein forming the clamping force gradient comprises forming a symmetrical vacuum gradient between the central region of the IC die and the peripheral region of the IC die, wherein the clamping force is greatest within the central portion of the IC die and diminishes substantially equally in all directions from the central portion toward opposing edges of the IC die.

Assignees

• Intel Corp

Inventors

• Oka Mihir
• Srinivasan Kartik
• Tan Wei
• Mellody James

Classifications

• H10W72/07188

  Apparatus chuck · CPC title

• H10W72/07141

  Means for applying energy, e.g. ovens or lasers · CPC title

• H10W72/07232

  Compression bonding, e.g. thermocompression bonding · CPC title

• H10W72/07178

  Means for aligning · CPC title

• H10W90/724

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title