Dynamic substrate thermal displacement compensation
US-2025391807-A1 · Dec 25, 2025 · US
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Mellody James patents
Mellody James is listed as an inventor on 6 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Mellody James |
| Total patents | 6 |
| First publication | Sep 16, 2021 |
| Latest publication | Dec 25, 2025 |
Notable patents
Publications ranked by popularity score, then publication date.
Thermal compression bonder nozzle with vacuum relief features
US-12176318-B2 · Dec 24, 2024 · US
Enhanced nozzle for disaggregated die handling during thermal compression bonding
US-2024213074-A1 · Jun 27, 2024 · US
Thermal compression bonder nozzle with vacuum relief features
US-2023238352-A1 · Jul 27, 2023 · US
Thermal compression bonder nozzle with vacuum relief features
US-11652080-B2 · May 16, 2023 · US
Thermal compression bonder nozzle with vacuum relief features
US-2021288021-A1 · Sep 16, 2021 · US
Recent patents
Latest publications not already listed above.
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Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Intel Corp | 6 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W72/07232 | 6 |
| H10W72/07141 | 5 |
| H10W72/07178 | 5 |
| H10W72/0711 | 5 |
| H01L24/75 | 5 |