Enhanced nozzle for disaggregated die handling during thermal compression bonding
US-2024213074-A1 · Jun 27, 2024 · US
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Patent family 91583880
This patent family groups 1 related publication across US. Members often share priority claims or equivalent filings in different countries.
| Field | Value |
|---|---|
| Family ID | 91583880 |
| Family type | — |
| Earliest priority | Dec 27, 2022 |
| First filing country | US |
| Member publications | 1 |
| Countries | US |
| Representative publication | US2024213074A1 — Enhanced nozzle for disaggregated die handling during thermal compression bonding |
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US2024213074A1 — Enhanced nozzle for disaggregated die handling during thermal compression bonding (published Jun 27, 2024)
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