Roughened copper foil, copper-cladded laminate board, and printed wiring board
US-12457686-B2 · Oct 28, 2025 · US
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Tateoka Ayumu patents
Tateoka Ayumu is listed as an inventor on 6 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Tateoka Ayumu |
| Total patents | 6 |
| First publication | Mar 28, 2024 |
| Latest publication | Oct 28, 2025 |
Notable patents
Publications ranked by popularity score, then publication date.
Resin composition, copper foil with resin, and printed wiring board
US-12331212-B2 · Jun 17, 2025 · US
Roughened copper foil, copper-clad laminate and printed wiring board
US-12104265-B2 · Oct 1, 2024 · US
Roughened copper foil, copper-clad laminate and printed wiring board
US-2024175162-A1 · May 30, 2024 · US
Roughened copper foil, copper-cladded laminate board, and printed wiring board
US-2024172359-A1 · May 23, 2024 · US
Resin composition, copper foil with resin, and printed wiring board
US-2024101858-A1 · Mar 28, 2024 · US
Recent patents
Latest publications not already listed above.
No data yet.
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Mitsui Mining & Smelting Co Ltd | 6 |
Top CPC classifications
Most common classification codes across this inventor's patents.