Electrolytic copper foil and preparation method therefor, negative electrode plate, secondary battery, battery module, battery pack and power consuming device

Patent metadata

Field	Value
Publication number	US-2023323556-A1
Application number	US-202318334552-A
Country	US
Kind code	A1
Filing date	Jun 14, 2023
Priority date	Sep 10, 2021
Publication date	Oct 12, 2023
Grant date	—

Abstract

A method for preparing an electrolytic copper foil includes placing an anode and a cathode to be plated in a twin crystal growth agent containing electroplating solution in an electroplating tank, and, under conditions that the electroplating solution is provided with randomly alternating transitions of one or two of an ultrasonic wave at a frequency f11 and an ultrasonic wave at a frequency f12 and one or two of an ultrasonic wave at a frequency f21 and an ultrasonic wave at a frequency f22, performing direct current electroplating to obtain the electrolytic copper foil, wherein f11>40 kHz, 15 kHz<f12≤40 kHz, 0 kHz<f21≤15 kHz, and f22=0 kHz.

First claim

What is claimed is:

1 . A method for preparing an electrolytic copper foil, comprising:
placing an anode and a cathode to be plated in a twin crystal growth agent containing electroplating solution in an electroplating tank; and under conditions that the electroplating solution is provided with randomly alternating transitions of one or two of an ultrasonic wave at a frequency f11 and an ultrasonic wave at a frequency f12 and one or two of an ultrasonic wave at a frequency f21 and an ultrasonic wave at a frequency f22, performing direct current electroplating to obtain the electrolytic copper foil, wherein f11>40 kHz, 15 kHz<f12≤40 kHz, 0 kHz<f21≤15 kHz, and f22=0 kHz.

2 . The method according to claim 1 , wherein performing the direct current electroplating comprises:
performing the direct current electroplating with a percentage of a total time for electroplating under conditions of the ultrasonic wave at the frequency f11 and the ultrasonic wave at the frequency f12 being 70%-90%, and a percentage of a total time for electroplating under conditions of the ultrasonic wave at the frequency f21 and the ultrasonic wave at the frequency f22 being 10%-30%.

3 . The method according to claim 1 , wherein performing the direct current electroplating comprises performing the direct current electroplating with:
a percentage of a time for electroplating under conditions of the ultrasonic wave at the frequency f11 being 40%-90%; and/or a percentage of a time for electroplating under conditions of the ultrasonic wave at the frequency f12 being 0-50%; and/or a percentage of a time for electroplating under conditions of the ultrasonic wave at the frequency f21 being 0-30%; and/or a percentage of a time for electroplating under conditions of the ultrasonic wave at the frequency f22 is 0-10%.

4 . The method according to claim 1 , wherein the direct current electroplating is carried out at a current density of 2 A/dm 2 -80 A/dm 2 .

5 . The method according to claim 1 , wherein the electroplating solution is a sulfuric acid-copper sulfate electroplating solution, and the electroplating solution further comprises copper ions, sulfuric acid, and chloride ions.

6 . The method according to claim 1 , wherein the electroplating solution further comprises a leveling agent and a brightening agent.

7 . An electrolytic copper foil prepared by the method according to claim 1 .

8 . The electrolytic copper foil according to claim 7 , wherein:
a volume percentage of a (111) crystal plane of the electrolytic copper foil is ≥60%; and/or a volume percentage of twining crystal grains in the electrolytic copper foil is ≥60%; and/or a normal-temperature tensile strength of the electrolytic copper foil is ≥50 kg/mm 2 ; and/or a Vickers hardness of the electrolytic copper foil is ≥180.

9 . A negative electrode plate, comprising the electrolytic copper foil according to claim 7 .

10 . The negative electrode plate, further comprising:
a negative electrode film layer provided on at least one surface of the electrolytic copper foil; wherein an adhesive force between the electrolytic copper foil and the negative electrode film layer is in a range of 10 N/m 2 -20 N/m 2 .

11 . A secondary battery, comprising the negative electrode plate according to claim 10 .

12 . A battery module, comprising the secondary battery according to claim 11 .

13 . A battery pack, comprising the secondary battery according to claim 11 .

14 . A power consuming device, comprising the secondary battery according to claim 11 .

Assignees

• Contemporary Amperex Technology Co Ltd

Inventors

• Wu Yukun
• Ge Xiaoming

Classifications

• H01M4/0404

  by coating on electrode collectors · CPC title

• C25D5/20 Primary

  Electroplating using ultrasonic waves · CPC title

• H01M4/139 Primary

  Processes of manufacture · CPC title

• C30B29/02

  Elements · CPC title

• H01M4/661

  Metal or alloys, e.g. alloy coatings (H01M4/669 take precedence) · CPC title