Planarization apparatus, planarization process, and method of manufacturing an article

Patent metadata

Field	Value
Publication number	US-2023061361-A1
Application number	US-202218054487-A
Country	US
Kind code	A1
Filing date	Nov 10, 2022
Priority date	Jan 31, 2020
Publication date	Mar 2, 2023
Grant date	—

Abstract

A superstrate for planarizing a substrate. The superstrate includes a body having a first side having a contact surface and a second side having a central portion and a peripheral portion surrounding the central portion. The peripheral portion includes a recessed region.

First claim

What is claimed is:

1 . A superstrate configured to be held by a chuck, wherein the chuck is a component of an apparatus comprising a substrate holder for holding a substrate, and wherein the chuck comprises a plurality of lands defining a central zone and a peripheral zone surrounding the central zone, the superstrate comprising:
a body having a first side and a second side opposite to the first side; and a mesa extending from the first side of the body, wherein an edge of the mesa is positioned inside from a edge of the body, and wherein the mesa has a contact surface to be in contact with a formable material formed on the substrate held by the substrate holder; wherein the second side of the body has a central portion and a peripheral portion surrounding the central portion, the peripheral portion including a recessed region, and wherein the second side of the body is configured to contact the plurality of lands of the chuck while being retained thereby.

2 . The superstrate of claim 1 , wherein recessed region is concentric with the body.

3 . The superstrate of claim 1 , wherein the recessed region includes a stepped down surface extending circumferentially throughout the peripheral portion of the second side.

4 . The superstrate of claim 1 , wherein the recessed region includes a tapered down surface extending circumferentially throughout the peripheral portion of the second side.

5 . The superstrate of claim 1 , wherein the recessed region of the second side has a radial width wider than the radial width from the edge of the mesa to the edge of the body.

6 . The superstrate of claim 1 , wherein the recessed region of the second side has a radial width equal to the radial width from the edge of the mesa to the edge of the body.

7 . The superstrate of claim 1 , wherein the recessed region further comprises a trench extending circumferentially between the central portion and an edge of the second side.

8 . The superstrate of claim 1 , wherein each land of the the plurality of lands of the chuck have the same height.

9 . The superstrate of claim 1 , wherein the recessed region of the second side is configured to be held by an outermost land among the plurality of lands of the chuck.

10 . A superstrate comprising:
a body having a first side and a second side opposite to the first side; and a mesa extending from the first side of the body, wherein an edge of the mesa is positioned inside from a edge of the body, wherein the second side of the body has a central portion and a peripheral portion surrounding the central portion, the peripheral portion including a recessed region.

Assignees

• Canon Kk

Inventors

• Bamesberger Seth J
• Ozturk Ozkan
• Jones Christopher Ellis
• Im Se-Hyuk

Classifications

• H10P72/0604

  Process monitoring, e.g. flow or thickness monitoring · CPC title

• H10P95/04

  Planarisation of conductive or resistive materials · CPC title

• H10W20/062 Primary

  by smoothing of conductive parts, e.g. by planarisation · CPC title

• H10P95/08

  Planarisation of organic insulating materials · CPC title

• H10P72/0428 Primary

  Apparatus for mechanical treatment or grinding or cutting · CPC title