Mold and mold manufacturing method

Patent metadata

Field	Value
Publication number	US-10040219-B2
Application number	US-201314015803-A
Country	US
Kind code	B2
Filing date	Aug 30, 2013
Priority date	Mar 25, 2013
Publication date	Aug 7, 2018
Grant date	Aug 7, 2018

Abstract

According to one embodiment, a mold includes a base, a first concave pattern, a second concave pattern, and a third concave pattern. The base includes a first surface and a pedestal projecting from the first surface. The pedestal includes a first region and a second region disposed outside the first region. The first concave pattern is formed in the first region. The second concave pattern is formed in the second region. The third concave pattern extends from the first region to the second region.

First claim

What is claimed is:

1. A mold for imprinting, the mold comprising:
a base comprising a first surface and a pedestal, the pedestal comprising a front surface projecting from the first surface, and the front surface comprising a first region and a second region disposed outward of the first region along a periphery of the pedestal;
a molding pattern formed in the first region and having a first depth extending inwardly of the front surface;
a set of distinct negative mark patterns formed in the second region and having a second depth extending inwardly of the front surface, each of the mark patterns comprising a plurality of pattern features; and
a set of channels formed in the second region and having a third depth extending inwardly of the front surface, each of the channels connecting the molding pattern to a respective one of the mark patterns, wherein the entirety and all end portions of each of the mark patterns and each of the channels are positioned inwardly of the periphery of the pedestal and are disposed inwardly from the front surface, and wherein the channels and mark patterns prevent resin imprinted by the molding pattern during use of the mold from overflowing by allowing the resin to fill the mark patterns by passing through the channels.

2. The mold of claim 1 , wherein:
the molding pattern includes features having the first depth and a first width, the first depth and width together defining a cross-sectional area of the features of the molding pattern;
the mark pattern features have the second depth and a second width, the second depth and width together defining a first cross-sectional area of the features of the mark pattern; and
the channels have the third depth and a third width, the third depth and width together defining a second cross-sectional area smaller than the cross-sectional area of the features of the molding pattern and the first cross-sectional area of the mark pattern features.

3. The mold of claim 1 , wherein a width of each of the channels is greater than widths of pattern features of the molding pattern or the mark pattern.

4. The mold of claim 1 , wherein the mark pattern features each comprise a channel extending perpendicular to a respective one of the channels connecting that respective mark pattern to the molding pattern.

5. The mold of claim 4 , wherein the perpendicular channels each have a length that is less than a length of the respective channel connecting that respective mark pattern to the molding pattern.

6. The mold of claim 1 , wherein the molding pattern is an interconnect pattern.

7. The mold of claim 1 , wherein the mark patterns also function as alignment marks or overlay metrology marks.

8. The mold of claim 1 , further comprising a set of additional channels, each of the additional channels connecting to and extending outwardly from the molding pattern and into the second region between two of the mark patterns.

9. The mold of claim 1 , wherein the second region is a peripheral region adjacent to the first region, the second region surrounding the first region.

10. The mold of claim 1 , wherein pattern features of the molding pattern have a first width, the mark pattern features have a second width, and each of the channels have a third width which is greater than the first width.

11. The mold of claim 1 , wherein the mark pattern features include a plurality of channels extending from a respective one of the channels connecting that respective mark pattern to the molding pattern, each of the mark pattern channels having a length that is less than a length of the channels connecting to the molding pattern.

12. The mold of claim 1 , wherein the first depth is in a range from about 10 nm to 200 nm.

13. The mold of claim 12 , wherein the second depth is in a range from about 10 nm to about 200 nm.

14. The mold of claim 13 , wherein the third depth is in a range from about 10 nm to about 200 nm.

15. The mold of claim 1 , wherein the third depth is in a range from about 10 nm to about 200 nm.

16. The mold of claim 15 , wherein the first depth is in a range from about 10 nm to 200 nm or the second depth is in a range from about 10 nm to about 200 nm.

Assignees

• Toshiba Memory Corp

Inventors

• Takekawa Yoko
• Inanami Ryouichi
• Asano Masafumi
• Takahata Kazuhiro
• Kobayashi Sachiko
• Nojima Shigeki
• Furutono Yohko
• Suzuki Masato
• Konomi Kenji

Classifications

• G03F9/7076

  Mark details, e.g. phase grating mark, temporary mark · CPC title

• B29C33/0055 Primary

  with incorporated overflow cavities (in particular in injection moulds B29C45/2669) · CPC title

• G03F7/0002

  Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping · CPC title

• G03F9/7042

  Alignment for lithographic apparatus using patterning methods other than those involving the exposure to radiation, e.g. by stamping or imprinting (non-exposure lithographic processes per se G03F7/0002) · CPC title

• B29C2033/422

  Moulding surfaces provided with a shape to promote flow of material in the mould cavity · CPC title