Circuit module

Patent metadata

Field	Value
Publication number	US-2022399255-A1
Application number	US-202217750454-A
Country	US
Kind code	A1
Filing date	May 23, 2022
Priority date	Jun 11, 2021
Publication date	Dec 15, 2022
Grant date	—

Abstract

A circuit module includes a substrate module including an upper main surface with a normal line extending in a vertical direction, an electronic component on the substrate module, and a bonding adhesive fixing the electronic component to the upper main surface. The electronic component includes a first electrode. The substrate module includes a second electrode on the right of the bonding adhesive. The first electrode is electrically connected to the second electrode through solder. A first recess recessed downward and including a bottom is in the upper main surface. An upper end of the second electrode is above the bottom. The first recess includes a first area on the left of a first electrode and overlapping the second electrode when viewed in the lateral direction. A material of the first recess is identical to a material of the upper main surface.

First claim

What is claimed is:

1 . A circuit module, comprising:
a substrate module including an upper main surface with a normal line extending in a vertical direction; an electronic component on the substrate module; and a bonding adhesive to fix the electronic component to the upper main surface; wherein the electronic component includes a first electrode; the substrate module includes a second electrode on a side of the bonding adhesive; the first electrode is electrically connected to the second electrode by solder; a first recess recessed downward and including a bottom is in the upper main surface; an upper end of the second electrode is above the bottom; the first recess includes a first area; when viewed in the vertical direction, the first area is between the second electrode and the bonding adhesive; and a material of the first recess is identical to a material of the upper main surface.

2 . The circuit module according to claim 1 , wherein the first recess includes a second area on a side of the second electrode when viewed in the vertical direction.

3 . The circuit module according to claim 1 , wherein the first recess is on a side of the second electrode.

4 . The circuit module according to claim 1 , wherein the first area is spaced apart from the second electrode in a lateral direction perpendicular or substantially perpendicular to the vertical direction.

5 . The circuit module according to claim 1 , wherein
the first recess further includes a second area on a side of the second electrode when viewed in the vertical direction; and the second area is spaced apart from the second electrode in a lateral direction perpendicular or substantially perpendicular to the vertical direction.

6 . The circuit module according to claim 2 , wherein
the first area includes a first portion that is in contact with the second electrode; the second area includes a second portion that is in contact with the second electrode; and a position of the first portion in the vertical direction is above a position of the second portion in the vertical direction.

7 . The circuit module according to claim 3 , wherein
a second recess recessed downward and including a bottom is provided in the upper main surface; the second recess further includes a second area on a right side of the second electrode when viewed in the vertical direction; and a material of the second recess is identical to the material of the upper main surface.

8 . The circuit module according to claim 5 , wherein
the first area is spaced apart from the second electrode in the lateral direction; and a distance between the first area and the second electrode in the lateral direction is longer than a distance between the second area and the second electrode in the lateral direction.

9 . The circuit module according to claim 7 , wherein the second area is spaced apart from the second electrode in a lateral direction perpendicular or substantially perpendicular to the vertical direction.

10 . The circuit module according to claim 7 , wherein
the first area includes a first portion in contact with the second electrode; the second area includes a second portion in contact with the second electrode; and a position of the first portion in the vertical direction is above a position of the second portion in the vertical direction.

11 . The circuit module according to claim 9 , wherein
the first area is spaced apart from the second electrode in the lateral direction; and a distance between the first area and the second electrode in the lateral direction is longer than a distance between the second area and the second electrode in the lateral direction.

12 . The circuit module according to claim 1 , wherein an upper end portion of the second electrode is tapered.

13 . The circuit module according to claim 1 , wherein
the electronic component includes an electronic component body; and the electronic component body partially overlaps the second electrode when viewed in the vertical direction.

14 . The circuit module according to claim 1 , wherein
the substrate module further includes a substrate; and a bottom surface of the second electrode is in contact with a top surface of the substrate.

15 . The circuit module according to claim 1 , wherein
the substrate module further includes:
a resin; and
an integrated circuit; wherein
the resin covers a lower portion of the second electrode and the integrated circuit; and the resin includes the upper main surface.

Assignees

• Murata Manufacturing Co

Inventors

• Okada Takanari
• Maeda Yasutaka

Classifications

• H10W70/464

  Additional interconnections in combination with leadframes · CPC title

• H10W72/801

  Interconnections on sidewalls of containers · CPC title

• H10W70/60

  Insulating or insulated package substrates; Interposers; Redistribution layers (leadframes H10W70/40) · CPC title

• H10W70/421 Primary

  Shapes or dispositions · CPC title

• H10W90/00 Primary

  Package configurations · CPC title