Package-on-package structure with organic interposer

Patent metadata

Field	Value
Publication number	US-2016056087-A1
Application number	US-201414466647-A
Country	US
Kind code	A1
Filing date	Aug 22, 2014
Priority date	Aug 22, 2014
Publication date	Feb 25, 2016
Grant date	—

Abstract

A device comprises a substrate having a die mounted on the first side of the substrate and a moldable underfill (MUF) disposed on the first side of the substrate and around the die. An interposer is mounted on the first side of the substrate, with the interposer having lands disposed on a first side of the interposer. The interposer mounted to the substrate by connectors bonded to a second side of the interposer, the connectors providing electrical connectivity between the interposer and the substrate. A package is mounted on the first side of the interposer and is electrically connected to the lands. At least one of the lands is aligned directly over the die and wherein a pitch of the connectors is different than a pitch of the lands.

First claim

1 . A device comprising:
a substrate having a die mounted on a first side of the substrate; a moldable underfill (MUF) disposed on the first side of the substrate and around the die; an interposer mounted on the first side of the substrate, the interposer having lands disposed on a first side of the interposer, and the interposer mounted to the substrate by connectors bonded to a second side of the interposer, the connectors providing electrical connectivity between the interposer and the substrate; and a package mounted on the first side of the interposer and electrically connected to the lands; wherein:
at least one of the lands is aligned directly over the die; and
a pitch of the connectors is different than a pitch of the lands.

2 . The device of claim 1 , wherein the connectors comprise first pillars disposed on the first side of the substrate.

3 . The device of claim 2 , wherein:
the connectors further comprise second pillars disposed on the second side of the interposer; and each of the first pillars is bonded to a respective one of the second pillars.

4 . The device of claim 3 , wherein the second pillars have a first pitch between about 200 μm and about 400 μm;
wherein:
the lands have a second pitch between about 350 μm and about 650 μm; and
the first pitch is less than the second pitch.

5 . The device of claim 3 , wherein the MUF is spaced apart from sidewalls of the second pillars.

6 . The device of claim 3 , wherein each pillar of the first pillars and the second pillars has a height that is equal to or less than a width of the respective pillar.

7 . The device of claim 1 , wherein the connectors comprise first pillars disposed on the second side of the interposer and bonded to the first side of the substrate by a solder ball.

8 . The device of claim 1 , wherein a top surface of the MUF is spaced apart from the second side of the interposer.

9 . A device comprising:
a substrate having a die disposed on a first side of the substrate; first pillars disposed on the first side of the substrate, wherein the first pillars have a first pitch; a moldable underfill (MUF) disposed on the first side of the substrate, the MUF surrounding the die and each of the first pillars; an interposer mounted over the first side of the substrate and having lands disposed on a first side of the interposer, wherein the lands have a second pitch greater than the first pitch, and wherein at least one of the lands is aligned directly over the die; and second pillars disposed on a second side of the interposer, wherein the second pillars are bonded to the first pillars and provide electrical connectivity between the interposer and the substrate.

10 . The device of claim 9 , wherein the second pillars extend into openings in the MUF.

11 . The device of claim 10 , wherein sidewalls of the openings are spaced apart from sidewalls of the second pillars.

12 . The device of claim 10 , wherein the MUF contacts sidewalls of the second pillars.

13 . The device of claim 9 , wherein the second pillars are bonded to the first pillars by solder connecting members.

14 . The device of claim 9 , wherein:
the second pillars have a pitch between about 200 μm and about 400 μm; and the lands have a pitch between about 350 μm and about 650 μm.

15 . The device of claim 9 , wherein a top surface of the MUF contacts the second side of the interposer.

16 . The device of claim 9 , wherein a topmost surface of the MUF is spaced apart from a bottommost surface of the interposer.

17 . The device of claim 16 , wherein a portion of the MUF is disposed between a top surface of the die and the bottommost surface of the interposer.

18 .- 20 . (canceled)

Assignees

• Taiwan Semiconductor Mfg

Inventors

• Wu Jiun Yi
• Liang yu-min
• Lii Mirng-Ji
• Lee Chien-Hsun
• Wang Tsung-Ding
• Cheng Jung Wei

Classifications

• H10W90/754

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W90/734

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W90/732

  between stacked chips · CPC title

• H10W90/724

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W90/722

  between stacked chips · CPC title