Composition, method of treating metal-containing layer by using the same, and method of manufacturing semiconductor device by using the same
US-2026098346-A1 · Apr 9, 2026 · US
for etching copper or alloys thereof
for etching copper or alloys thereof · Cooperative Patent Classification (CPC)
Chemical and metallurgical processes, compounds, and materials.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | C23F1/34 |
| Official title | for etching copper or alloys thereof |
| Display label | for etching copper or alloys thereof |
| Total patents | 57 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is stable.
| Year | Patents |
|---|---|
| 2015 | 8 |
| 2016 | 9 |
| 2017 | 4 |
| 2018 | 3 |
| 2019 | 5 |
| 2020 | 2 |
| 2021 | 2 |
| 2022 | 5 |
| 2023 | 6 |
| 2024 | 9 |
| 2025 | 2 |
| 2026 | 2 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Composition, method of treating metal-containing layer by using the same, and method of manufacturing semiconductor device by using the same
US-2026005029-A1 · Jan 1, 2026 · US
Copper etching solution
US-12503775-B2 · Dec 23, 2025 · US
Etching composition, method of etching metal-containing film by using the same, and method of manufacturing semiconductor device by using the same
US-2025129288-A1 · Apr 24, 2025 · US
Method of recovering electrode material and method of manufacturing recycled electricity storage device
US-2024387893-A1 · Nov 21, 2024 · US
Eco-friendly hydrophobic or ultrahydrophobic coating method
US-12146070-B2 · Nov 19, 2024 · US
Etching compositions
US-2024376606-A1 · Nov 14, 2024 · US
Co/Cu selective wet etchant
US-12110436-B2 · Oct 8, 2024 · US
Negative electrode comprising a protective layer for a lithium secondary battery, method for manufacturing same, and lithium secondary battery including same
US-12107259-B2 · Oct 1, 2024 · US
Method for manufacturing laminate
US-2024179848-A1 · May 30, 2024 · US
Nanotextured metal powders for 3D printing of metals
US-11938536-B2 · Mar 26, 2024 · US
Methods for wet atomic layer etching of copper
US-11866831-B2 · Jan 9, 2024 · US
Chemical liquid and method for treating object to be treated
US-11859119-B2 · Jan 2, 2024 · US
Etching compositions
US-2023243041-A1 · Aug 3, 2023 · US
Etching chelating agent, manufacturing method thereof, and etching solution composition
US-11674229-B2 · Jun 13, 2023 · US
Methods For Wet Atomic Layer Etching Of Copper
US-2023140900-A1 · May 11, 2023 · US
Treatment liquid, chemical mechanical polishing method, and method for treating semiconductor substrate
US-2023099612-A1 · Mar 30, 2023 · US
Eco-friendly hydrophobic or ultrahydrophobic coating method
US-2023081036-A1 · Mar 16, 2023 · US
CO/CU Selective Wet Etchant
US-2023002675-A1 · Jan 5, 2023 · US
Manufacturing method for substrate having conductive pattern, manufacturing method for electronic device, substrate having conductive pattern, and protective film for metal nanobody
US-2022400553-A1 · Dec 15, 2022 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC C23F1/34?
- CPC C23F1/34 is the Cooperative Patent Classification code for “for etching copper or alloys thereof.”
- How many patents are filed under CPC C23F1/34 (for etching copper or alloys thereof)?
- Our database includes 57 publications tagged with this CPC code.
- Is patent activity under CPC C23F1/34 growing?
- Publication counts under this code: 9 in 2024 vs 2 in 2025 (latest complete years).