Method for forming pattern, method for manufacturing ornament, method for manufacturing belt for wristwatch, method for manufacturing structure for mounting wiring, method for manufacturing semiconductor device, and method for manufacturing printed circuit board

Patent metadata

Field	Value
Publication number	US-10604859-B2
Application number	US-201715696732-A
Country	US
Kind code	B2
Filing date	Sep 6, 2017
Priority date	Sep 27, 2016
Publication date	Mar 31, 2020
Grant date	Mar 31, 2020

Abstract

A method for forming a pattern in which a plating layer is selectively formed on a base material using a resin layer as a mask, includes resin layer-forming in which the resin layer is formed on the base material; and patterning in which the resin layer is selectively removed, in which in the patterning, a part of the resin layer is sublimed by heating to be removed.

First claim

What is claimed is:

1. A method for forming a pattern in which a plating layer is selectively formed on a base material using a resin layer as a mask, the method comprising:
forming a primer layer on the base material;
forming the resin layer on the primer layer;
patterning the resin layer by selectively removing a part by of the resin layer, wherein the part of the resin layer is sublimed by heating to be removed; and
inspecting the patterned resin layer based on a fluorescence of the patterned resin layer,
wherein the primer layer includes a π bond (pi bond);
wherein the resin layer comprises at least one of anthracene or naphthacene; and
wherein the primer layer comprises at least one of phenyltrimethoxysilane or vinyltrimethoxysilane.

2. The method for forming a pattern according to claim 1 , further comprising partially heating the resin layer with an infrared ray to pattern the resin layer.

3. The method for forming a pattern according to claim 2 ,
wherein the infrared ray is a laser beam.

4. The method for forming a pattern according to claim 1 ,
wherein the resin layer is configured to fluoresce when irradiated with an inspection irradiation.

5. The method for forming a pattern according to claim 4 ,
wherein the resin layer is an acene having a molecular weight of 150 or more and 300 or less.

6. The method for forming a pattern according to claim 5 , further comprising:
wherein the primer layer having a π bond enhances an adhesion between the base material and the resin layer on the base material, before forming the resin layer.

7. The method for forming a pattern according to claim 1 , further comprising:
plating a part of the base material from which the resin has been removed to form the plating layer, after the resin layer.

8. A method for manufacturing an ornament to which the method for forming a pattern according to claim 1 is applied.

9. A method for manufacturing an ornament to which the method for forming a pattern according to claim 2 is applied.

10. A method for manufacturing an ornament to which the method for forming a pattern according to claim 3 is applied.

11. A method for manufacturing an ornament to which the method for forming a pattern according to claim 4 is applied.

12. A method for manufacturing an ornament to which the method for forming a pattern according to claim 5 is applied.

13. A method for manufacturing an ornament to which the method for forming a pattern according to claim 6 is applied.

14. A method for manufacturing an ornament to which the method for forming a pattern according to claim 7 is applied.

15. A method for manufacturing a belt for a wristwatch to which the method for forming a pattern according to claim 1 is applied.

16. A method for manufacturing a structure for mounting wiring to which the method for forming a pattern according to claim 1 is applied.

17. A method for manufacturing a semiconductor device to which the method for forming a pattern according to claim 1 is applied.

18. A method for manufacturing a printed circuit board to which the method for forming a pattern according to claim 1 is applied.

Assignees

• Seiko Epson Corp

Inventors

• Miyakawa Takuya

Classifications

• C25D5/022 Primary

  using masking means · CPC title

• G04B37/1486

  Arrangements for fixing to a bracelet (building watches into bracelets (montre marquise) G04B37/12; arrangements for hanging pocket- or other watches on chains G04B37/1446) · CPC title

• B41J2/1623

  bonding and adhesion · CPC title

• B41J2/1629

  wet etching · CPC title

• C25D5/48

  After-treatment of electroplated surfaces · CPC title