Method for manufacturing ceramic electronic component, and ceramic electronic component

Patent metadata

Field	Value
Publication number	US-10242789-B2
Application number	US-201615175655-A
Country	US
Kind code	B2
Filing date	Jun 7, 2016
Priority date	Jun 16, 2015
Publication date	Mar 26, 2019
Grant date	Mar 26, 2019

Abstract

A manufacturing method that is capable of forming an electrode on any part of a surface of a sintered ceramic body in accordance with a simple approach, and a ceramic electronic component manufactured by the method. The method for manufacturing a ceramic electronic component includes steps of preparing a sintered ceramic body containing a metal oxide, irradiating an electrode formation region on a surface of the ceramic body with a laser to partially lower resistance of the ceramic body, thereby forming a low-resistance portion, and subjecting the ceramic body to plating to deposit a plated metal serving as an electrode on the low-resistance portion, and growing the plated metal to extend over the entire electrode formation region.

First claim

What is claimed is:

1. A method for manufacturing a ceramic electronic component, the method comprising the steps of:
preparing a sintered ceramic body containing a metal oxide;
locally heating an electrode formation region on a surface of the ceramic body to partially lower resistance of the ceramic body, thereby forming a low-resistance portion; and
subjecting the ceramic body to plating to deposit a plated metal serving as an electrode on the low-resistance portion, and causing a growth of the plated metal to extend over the entire electrode formation region.

2. The method for manufacturing the ceramic electronic component according to claim 1 , wherein the low-resistance portion includes a reduced layer obtained by partially reducing the metal oxide contained in the ceramic body.

3. The method for manufacturing the ceramic electronic component according to claim 2 , wherein a surface layer of the reduced layer is covered with a reoxidized layer.

4. The method for manufacturing the ceramic electronic component according to claim 1 , wherein the local heating is any one of laser irradiation, electron beam irradiation, and local heating with an image furnace.

5. The method for manufacturing the ceramic electronic component according to claim 4 ,
wherein more than one site in the electrode formation region is irradiated with a laser at a predetermined distance, thereby dispersedly forming more than one low-resistance portion in the electrode formation region, and
plated metals deposited on the low-resistance portions are grown with the plated metals as nuclei, and the plating is continued until the plated metals are connected to each other.

6. The method for manufacturing the ceramic electronic component according to claim 4 ,
wherein the electrode formation region is densely irradiated with a laser to form the continuous low-resistance portion in the electrode formation region, and
the plated metal deposited on the low-resistance portion is grown with the plated metal as a nucleus, and the plating is continued until the plated metal extends over the entire electrode formation region.

7. The method for manufacturing the ceramic electronic component according to claim 1 , wherein an electrolytic plating method is used for the plating.

8. The method for manufacturing the ceramic electronic component according to claim 1 , wherein the ceramic body includes ferrite.

9. The method for manufacturing the ceramic electronic component according to claim 8 ,
wherein the ceramic body includes Ni—Zn based ferrite, and
the low-resistance portion is formed by partially reducing Fe contained in the ferrite.

10. The method for manufacturing the ceramic electronic component according to claim 8 ,
wherein the ceramic body includes Ni—Cu—Zn based ferrite, and
the low-resistance portion is formed by partially reducing at least one of Fe and Cu contained in the ferrite.

Assignees

• Murata Manufacturing Co

Inventors

• Maki Yoshifumi
• Ishida Takuya
• Tomioka Hirotsugu
• Hirai Shinya
• Katayama Daisuke

Classifications

• H01F27/24

  Magnetic cores · CPC title

• H01F41/041 Primary

  Printed circuit coils (apparatus or processes for manufacturing printed circuits in general H05K3/00) · CPC title

• H01F27/2804 Primary

  Printed windings · CPC title

• H01F17/045

  with core of cylindric geometry and coil wound along its longitudinal axis, i.e. rod or drum core · CPC title

• H01F17/0033

  with the coil helically wound around a magnetic core · CPC title