Package and Method for Manufacturing the Same

Patent metadata

Field	Value
Publication number	US-2021305123-A1
Application number	US-202017077815-A
Country	US
Kind code	A1
Filing date	Oct 22, 2020
Priority date	Mar 27, 2020
Publication date	Sep 30, 2021
Grant date	—

Abstract

A package includes a die having a first side and a second side opposite to each other. The package also includes an encapsulating material surrounding the die. The package further includes a redistribution layer (RDL) structure disposed over the first side of the die and the encapsulating material. The package yet includes a heat dissipating feature disposed over the second side of the die and the encapsulating material. In addition, the package includes a first screw assembly penetrating through the die, the RDL structure and the heat dissipating feature.

First claim

What is claimed is:

1 . A package, comprising:
a first die having a first side and a second side opposite to each other; an encapsulating material surrounding the first die; a redistribution layer (RDL) structure disposed over the first side of the first die and the encapsulating material; a heat dissipating feature disposed over the second side of the first die and the encapsulating material; and a first screw assembly penetrating through the first die, the RDL structure and the heat dissipating feature.

2 . The package of claim 1 , wherein the first die has a size of about 62500 mm 2 to about 90000 mm 2 .

3 . The package of claim 1 , wherein the first die has a length or a diameter of about 250 mm to about 320 mm.

4 . The package of claim 1 , wherein the first die has rounded corners.

5 . The package of claim 1 , wherein the first screw assembly comprises a bolt, and the bolt has a diameter of about 1 mm to about 10 mm.

6 . The package of claim 1 , further comprising a second screw assembly penetrating through the encapsulating material, the RDL structure, and the heat dissipating feature.

7 . The package of claim 1 , further comprising an adhesive layer disposed between the first die and the heat dissipating feature, and the first screw assembly penetrates through the adhesive layer.

8 . The package of claim 7 , wherein the adhesive layer has a center portion and an edge portion, and the thicknesses of the center portion and the edge portion are different.

9 . The package of claim 1 , further comprising a second die disposed adjacent to the first die and surrounded by the encapsulating material, wherein the first die has a size at least 30 times larger than that of the second die.

10 . The package of claim 1 , further comprising a third die surrounded by the encapsulating material, wherein the third die is electrically isolated from the first die.

11 . The package of claim 1 , further comprising a substrate attaching to the RDL structure through connectors, and the first screw assembly penetrates through the substrate.

12 . A package, comprising:
a first functional die and a second functional die surrounded by an encapsulating material, wherein the first functional die has a size greater than that of the second functional die; a redistribution layer (RDL) structure disposed over a first side of the first functional die, a first side of the second functional die, and a first side of the encapsulating material; a heat dissipating feature disposed over a second side of the first functional die, a second side of the second functional die, and a second side of the encapsulating material; and a first screw assembly penetrating through the first die, the RDL structure, and the heat dissipating feature.

13 . The package of claim 12 , further comprising a second screw assembly penetrating through the encapsulating material, the RDL structure, and the heat dissipating feature.

14 . The package of claim 12 , wherein the first functional die has a size at least 25 times greater than that of the second functional die.

15 . The package of claim 12 , further comprising a substrate attaching to the RDL structure, and the first screw assembly penetrates through the substrate.

16 . The package of claim 12 , wherein the first functional die comprises first contact features at its center and second contact features at its edge, and the second functional die comprises third contact features at its center and fourth contact features at its edge, wherein a height difference of the first contact features and the second contact features is greater than the height difference of the third contact features and the fourth contact features.

17 . The package of claim 12 , wherein the first functional die is thicker than the second functional die.

18 . A method, comprising:
disposing a first die over a carrier, wherein the first die has a first side and a second side opposite to the first side; forming an encapsulating material surrounding the first die; grinding the first die and the encapsulating material from the second side of the first die; forming a redistribution layer (RDL) structure over the second side of the first die and the encapsulating material; removing the carrier; and disposing a heat dissipating feature over the first side of the first die, and disposing a screw assembly that penetrates through the first die, the RDL structure, and the heat dissipating feature.

19 . The method of claim 18 , wherein the first die has size of about 900 mm 2 to about 90000 mm 2 .

20 . The method of claim 18 , further comprising disposing a second die over the carrier before the forming the encapsulating material, and wherein the first die has a size at least 25 times larger than that of the second die.

Assignees

• Taiwan Semiconductor Mfg Co Ltd

Inventors

• Yu Chen-Hua
• Kuo Tin-Hao

Classifications

• H10W90/288

  characterised by arrangements for thermal management of the stacked chips · CPC title

• H10W70/099

  Connecting interconnections to insulating or insulated package substrates, interposers or redistribution layers · CPC title

• H10W72/073

  of die-attach connectors · CPC title

• H10W72/0198

  batch processes · CPC title

• H10W72/874

  On different surfaces · CPC title