Systems and methods for powering an integrated circuit having multiple interconnected die

Patent metadata

Field	Value
Publication number	US-2020286858-A1
Application number	US-202016810520-A
Country	US
Kind code	A1
Filing date	Mar 5, 2020
Priority date	Mar 5, 2019
Publication date	Sep 10, 2020
Grant date	—

Abstract

The power on wafer assembly can include: a compliant connector, an integrated circuit, a printed circuit board (PCB), a power component, and a set of compliant connectors. The power on wafer assembly can optionally include: a compression element, a cooling system, a set of mechanical clamping components, and a power source. However, the power on wafer assembly can additionally or alternately include any other suitable components.

First claim

1 . An assembly comprising:
a printed circuit board (PCB) defining a first surface of the PCB; a semiconductor, defining a second surface of the semiconductor, comprising: a substrate; and a first die and a second die formed within the substrate; a first and second power converter arranged between the first surface of the PCB and the second surface of the semiconductor, the first and second power converters electrically connected to the first and second die, respectively; and a compliant connector electrically connecting the PCB and the first power converter; wherein the second power converter is electrically coupled to the PCB.

2 . The assembly of claim 1 , wherein the semiconductor further comprises:
a circuit layer formed at each of the first and second die; and a plurality of inter-die connections communicatively connecting the first and second die.

3 . The assembly of claim 1 , further comprising a compression element arranged between the PCB and the first power converter.

4 . The assembly of claim 3 , wherein the compression element comprises the compliant connector.

5 . The assembly of claim 3 , further comprising a plurality of clamping components mechanically coupling the PCB to the semiconductor and preloading the compression element.

6 . The assembly of claim 1 , further comprising a first cold plate, arranged between the first power converter and the PCB, that is thermally connected to the first power converter.

7 . The assembly of claim 6 , further comprising:
a fluid reservoir; and a fluid manifold extending through a thickness of the PCB and connecting the first cold plate to the reservoir.

8 . The assembly of claim 6 , further comprising:
a second cold plate arranged proximate a second surface of the integrated circuit opposite the second surface of the semiconductor; and a fluid manifold fluidly connecting the first cold plate and the second cold plate.

9 . The assembly of claim 1 , wherein the semiconductor comprises a wafer-scale processor.

10 . The assembly of claim 1 , wherein the power converter comprises a voltage regulator, a current transformer, and a driver.

11 . The assembly of claim 1 , further comprising:
a power source opposing the first power converter across a thickness of the PCB; and a through silicon via (TSV) extending through a thickness of the PCB, the TSV electrically connecting the power source to the compliant connector.

12 . An assembly comprising:
a printed circuit board (PCB) defining a first surface of the PCB; an integrated circuit having a set of conductive pads arranged along a second surface of the integrated circuit; a power converter arranged between first surface of the PCB and the second surface of the integrated circuit, the power converter electrically connected to each of the set of conductive pads; and a compliant connector extending between the PCB and the power converter.

13 . The assembly of claim 12 , further comprising a compression element, comprising the complaint connector, arranged between the PCB and the first power converter.

14 . The assembly of claim 12 , wherein the integrated circuit comprises a wafer-scale processor.

15 . The assembly of claim 12 , further comprising a first cold plate arranged between the power converter and the PCB, the first cold plate thermally connected to the power converter.

16 . The assembly of claim 15 , wherein the first cold plate is mechanically biased away from the PCB.

17 . The assembly of claim 15 , wherein:
the first cold plate is thermally connected to the power converter at a first region on a broad face of the power converter, and the compliant connector is electrically connected to the power converter at a second region on the broad face of the power converter, the second region separate and distinct from the first region.

18 . The assembly of claim 17 , wherein the second region comprises a periphery of the broad face of the first power component.

19 . The assembly of claim 12 , wherein the power converter comprises a voltage regulator.

20 . The assembly of claim 12 , wherein the integrated circuit further comprises:
a substrate; a plurality of die formed with the substrate; a circuit layer formed at each of the plurality of die; a plurality of inter-die connections that communicatively connect disparate die formed with the substrate, wherein each of the plurality of inter-die connections extends between each pair of adjacent die of the plurality of die, wherein each of the plurality of inter-die connections comprises a conductive material that is the same as the conductive material forming intra-die connections on the circuit layer of each die; a plurality of peripheral connections distinct from the plurality of inter-die connections are formed along at least one side of a subset of the plurality of die positioned along an outer periphery of the substrate; and a plurality of power converters comprising the power converter, wherein each of the plurality of die is connected to one or more of the plurality of power converters.

Assignees

• Cerebras Systems Inc

Inventors

• Fricker Jean-Philippe

Classifications

• H10W90/753

  between laterally-adjacent chips · CPC title

• H10W90/701

  characterised by the relative positions of pads or connectors relative to package parts · CPC title

• H10W78/00

  Detachable holders for supporting packaged chips in operation · CPC title

• H10W70/635 Primary

  Through-vias · CPC title

• H10W40/47

  by flowing liquids, e.g. forced water cooling · CPC title