Ring assembly and chuck assembly having the same

Patent metadata

Field	Value
Publication number	US-2018090344-A1
Application number	US-201715470044-A
Country	US
Kind code	A1
Filing date	Mar 27, 2017
Priority date	Sep 28, 2016
Publication date	Mar 29, 2018
Grant date	—

Abstract

A ring assembly and a chuck assembly therewith are provided. The ring assembly may include an edge ring that is provided to enclose a chuck body supporting a substrate. The edge ring may include a first top surface, a second top surface positioned outside the first top surface and above the first top surface, a first inner side surface connecting the first top surface to the second top surface, and at least one first flow hole extending outward from one of the first top surface and the first inner side surface, thereby penetrating the edge ring.

First claim

1 . A ring assembly comprising:
an edge ring configured to enclose a chuck body, the chuck body configured to support a substrate, the edge ring including,
a first top surface,
a second top surface outside the first top surface and above the first top surface with respect to a base of the chuck body,
a first inner side surface connecting the first top surface to the second top surface, wherein
one of the first top surface and the first inner side surface includes at least one first flow hole extending outward therefrom from such that the edge ring has the first flow hole penetrating therethrough.

2 . The ring assembly of claim 1 , wherein the first inner side surface includes the first flow hole extending outward therefrom between the first top surface and the second top surface.

3 . The ring assembly of claim 2 , wherein the first inner side surface has the first flow hole extending therefrom parallel to the first top surface.

4 . The ring assembly of claim 1 , wherein the first inner side surface includes the first flow hole extending outward therefrom and downward in an inclined manner.

5 . The ring assembly of claim 1 , wherein the first flow hole comprises:
a first hole region extending downward from the first top surface; and a second hole region extending outward from the first hole region.

6 . The ring assembly of claim 1 , wherein the edge ring includes multiple ones of the first flow hole each spaced apart from each other along a circumference direction of the edge ring.

7 . The ring assembly of claim 6 , wherein, when viewed in a plan view, the multiple ones of the first flow hole included in the edge ring are each arch shaped.

8 . The ring assembly of claim 1 , wherein the edge ring further comprises:
a third top surface outside and above the second top surface with respect to the base of the chuck body; a second inner side surface connecting the second top surface to the third top surface, the second inner side surface including at least one second flow hole therein above the first flow hole such that the edge ring has the at least one second flow hole penetrating therethrough.

9 . The ring assembly of claim 8 , wherein the second flow hole is between the second top surface and the third top surface.

10 . The ring assembly of claim 1 , wherein
each of the first and second top surfaces is a flat surface, and the first inner side surface is one of inclined upward in a direction from the first top surface to an outside or vertically extending upward from the first top surface.

11 - 14 . (canceled)

15 . A chuck assembly, comprising:
a chuck body configured to support a substrate; and an edge ring configured to enclose the chuck body, the edge ring including,
a first top surface below a top surface of the chuck body,
a second top surface outside and above the first top surface with respect to a base of the chuck body, and
a first inner side surface connecting the first top surface to the second top surface, wherein
one of the first top surface and the first inner side surface includes at least one first flow hole extending outward therefrom such that the at least one first flow hole penetrates the edge ring.

16 . The chuck assembly of claim 15 , wherein the first inner side surface includes the first flow hole extending outward therefrom between the first top surface and the second top surface

17 . The chuck assembly of claim 15 , wherein the first flow hole comprises:
first hole region extending downward from the first top surface; and a second hole region extending outward from the first hole region.

18 . The chuck assembly of claim 15 , wherein the first flow hole is below the top surface of the chuck body.

19 . (canceled)

20 . The chuck assembly of claim 15 , wherein the edge ring further comprises:
a third top surface outside and above the second top surface with respect to the base of the chuck body; and a second inner side surface connecting the second top surface to the third top surface, the second inner side surface including at least one second flow hole therein above the first flow hole such that the edge ring has the at least one second flow hole penetrating therethrough.

21 . A chuck assembly configured to support a substrate, the chuck assembly comprising:
a baseplate having an electrostatic substrate chuck on an upper surface thereof; and an edge ring configured to surround the electrostatic substrate chuck, the edge ring including an upper surface below a bottom surface of the substrate with a gap therebetween, the edge ring having at least one first flow hole therein such that the edge ring is configured to exhaust a process gas from the gap via the at least one first flow hole.

22 . The chuck assembly of claim 21 , wherein the upper surface has an upwardly stepped shape.

23 . The chuck assembly of claim 21 , wherein the edge ring includes a ring body and a flange on the ring body, the flange extending inwards towards a center of the baseplate, and the ring body including the at least one first flow hole therein.

24 . The chuck assembly of claim 23 , wherein the ring body includes a plurality of the at least one first flow hole therein.

25 . The chuck assembly of claim 21 , wherein the ring body further includes a supporting member configured to vertically separate the at least one first flow hole from a least one second flow hole above the at least one first flow hole in the ring body.

Assignees

• Samsung Electronics Co Ltd

Inventors

• KIM SungHyup
• Kim Dong-Wook
• Park Sungmoon
• Um Junghwan
• Oh Taeseok

Classifications

• H10P72/7611

  characterised by edge profile or support profile · CPC title

• H10P72/50

  for positioning, orientation or alignment · CPC title

• H10P72/14

  Vertical carrier comprising wall type elements whereby the substrates are horizontally supported, e.g. comprising sidewalls · CPC title

• H10P72/00

  Handling or holding of wafers, substrates or devices during manufacture or treatment thereof · CPC title

• H10P50/242

  of Group IV materials · CPC title