Substrate processing apparatus
US-2025210322-A1 · Jun 26, 2025 · US
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Um Junghwan patents
Um Junghwan is listed as an inventor on 9 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Um Junghwan |
| Total patents | 9 |
| First publication | Mar 9, 2017 |
| Latest publication | Jun 26, 2025 |
Notable patents
Publications ranked by popularity score, then publication date.
Edge ring, dry etching apparatus having the same, and operation method of etching apparatus
US-2024071732-A1 · Feb 29, 2024 · US
Method of manufacturing integrated circuit using etching process
US-2023110643-A1 · Apr 13, 2023 · US
System for fabricating a semiconductor device
US-10892142-B2 · Jan 12, 2021 · US
Ring assembly and chuck assembly having the same
US-10672629-B2 · Jun 2, 2020 · US
System for fabricating a semiconductor device
US-2019287766-A1 · Sep 19, 2019 · US
Ring member with air holes and substrate processing system including the same
US-10312059-B2 · Jun 4, 2019 · US
Ring assembly and chuck assembly having the same
US-2018090344-A1 · Mar 29, 2018 · US
Ring member with air holes and substrate processing system including the same
US-2017069471-A1 · Mar 9, 2017 · US
Recent patents
Latest publications not already listed above.
No data yet.
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Samsung Electronics Co Ltd | 9 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H01J37/32715 | 6 |
| H01J37/32642 | 5 |
| H01J37/32697 | 5 |
| H01J37/32082 | 4 |
| H10P50/242 | 4 |