Film formation system and film formation method for forming metal film

Patent metadata

Field	Value
Publication number	US-2016201210-A1
Application number	US-201414912234-A
Country	US
Kind code	A1
Filing date	Aug 20, 2014
Priority date	Aug 20, 2013
Publication date	Jul 14, 2016
Grant date	—

Abstract

A solid electrolyte membrane ( 13 ) is arranged on a surface of an anode ( 11 ) between the anode ( 11 ) and a substrate (B) that serves as a cathode. The solid electrolyte membrane ( 13 ) is brought into contact with the substrate (B). At the same time, a metal film (F) is formed on the surface of the substrate (B) by causing metal to precipitate onto the surface of the substrate (B) from metal ions through application of voltage between the anode ( 11 ) and the substrate (B) in a first contact state where the solid electrolyte membrane ( 13 ) contacts the substrate (B). The metal ions are contained inside the solid electrolyte membrane ( 13 ).

First claim

1 . A film formation method for forming a metal film, the film formation method comprising:
arranging a solid electrolyte membrane on a surface of an anode between the anode and a substrate, the substrate serving as a cathode; bringing the solid electrolyte membrane into contact with the substrate; forming a metal film on a surface of the substrate by causing metal to precipitate onto the surface of the substrate from metal ions through application of voltage between the anode and the substrate in a first contact state where the solid electrolyte membrane contacts the substrate, the metal ions being contained inside the solid electrolyte membrane, the metal film being made of the metal; during formation of the metal film, suspending formation of the metal film by changing a relative position between the solid electrolyte membrane and the substrate from the first contact state to a non-contact state where the solid electrolyte membrane does not contact the substrate; after suspension of the formation, changing the relative position between the solid electrolyte membrane and the substrate into a second contact state different from the first contact state; and resuming formation of the metal film in the second contact state.

2 . The film formation method according to claim 1 , wherein, at the time of resuming formation of the metal film, the relative position between the solid electrolyte membrane and the substrate is changed by relatively rotationally moving the solid electrolyte membrane and the substrate.

3 . The film formation method according to claim 1 , wherein a porous material is used as the anode, and the porous material allows a solution containing the metal ions to penetrate through the porous material and supplies the metal ions to the solid electrolyte membrane.

4 . The film formation method according to claim 3 , further comprising:
in forming the metal film, uniformly pressurizing a film formation region of the substrate with the solid electrolyte membrane by pressurizing a surface of the anode, the surface of the anode corresponding to the film formation region in which the metal film is formed within the surface of the substrate.

5 . A film formation system for forming a metal film, the film formation system comprising:
an anode; a solid electrolyte membrane arranged on a surface of the anode between the anode and a substrate, the substrate serving as a cathode; a power supply unit configured to apply voltage between the anode and the substrate, the film formation system being configured to form a metal film on a surface of the substrate by causing metal to precipitate onto the surface of the substrate from metal ions through application of voltage between the anode and the substrate in a first contact state where the solid electrolyte membrane contacts the substrate, the metal ions being contained inside the solid electrolyte membrane, the metal film being made of the metal; and a change mechanism configured to change a relative position between the solid electrolyte membrane and the substrate from the first contact state to a non-contact state where the solid electrolyte membrane does not contact the substrate and then change the relative position into a second contact state different from the first contact state.

6 . The film formation system according to claim 5 , wherein the change mechanism is configured to change the relative position between the solid electrolyte membrane and the substrate by relatively rotationally moving the solid electrolyte membrane and the substrate.

7 . The film formation system according to claim 5 or 6 , wherein the anode is made of a porous material, and the porous material allows a solution containing the metal ions to penetrate through the porous material and supplies the metal ions to the solid electrolyte membrane.

8 . The film formation system according to claim 7 , further comprising:
a contact pressurizing unit configured to contact the anode and pressurize the surface of the substrate with the solid electrolyte membrane via the anode, the contact pressurizing unit being configured to pressurize a surface of the anode so as to uniformly pressurize a film formation region, the surface of the anode corresponding to the film formation region in which the metal film is formed within the surface of the substrate.

Assignees

• Toyota Motor Co Ltd

Inventors

• Hiraoka Motoki
• Yanagimoto Hiroshi
• Sato Yuki

Classifications

• C25D17/007

  Current directing devices · CPC title

• C25D17/002

  Cell separation, e.g. membranes, diaphragms · CPC title

• C25D5/04 Primary

  Electroplating with moving electrodes · CPC title

• C25D5/22 Primary

  Electroplating combined with mechanical treatment during the deposition · CPC title

• C25D5/08

  Electroplating with moving electrolyte e.g. jet electroplating {(using locally applied jets of electrolyte C25D5/026)} · CPC title