Poly(phenylene ether) resin composition, prepreg, metal-clad laminate, and printed-wiring board

Patent metadata

Field	Value
Publication number	US-2016168378-A1
Application number	US-201514956358-A
Country	US
Kind code	A1
Filing date	Dec 1, 2015
Priority date	Dec 16, 2014
Publication date	Jun 16, 2016
Grant date	—

Abstract

A poly(phenylene ether) resin composition includes a modified poly(phenylene ether) copolymer, a polymer substance having a weight-average molecular weight larger than that of the modified poly(phenylene ether) copolymer, and a compound compatible with the modified poly(phenylene ether) copolymer. The modified poly(phenylene ether) copolymer is produced by modifying the phenolic hydroxyl group in a molecular terminal of a poly(phenylene ether) copolymer with a compound having a carbon-carbon unsaturated double bond. The polymer substance has a structure of at least one selected from a polystyrene framework, a polybutadiene framework, and a methacrylate framework. The polymer substance has a softening temperature not higher than 110° C. The compound compatible with the modified poly(phenylene ether) copolymer includes two or more carbon-carbon unsaturated double-bonds per molecule, and has a melting point not higher than 30° C.

First claim

What is claimed is:

1 . A poly(phenylene ether) resin composition comprising:
a modified poly(phenylene ether) copolymer in which a phenolic hydroxyl group in a molecular terminal of a poly(phenylene ether) copolymer is modified with a compound including a carbon-carbon unsaturated double bond; a polymer substance having: a weight-average molecular weight larger than a weight-average molecular weight of the modified poly(phenylene ether) copolymer; a structure of at least one selected from a polystyrene framework, a polybutadiene framework, and a methacrylate framework; and a softening temperature not higher than 110° C.; and a compound including two or more carbon-carbon unsaturated double-bonds per molecule, having a melting point not higher than 30° C., and being compatible with the modified poly(phenylene ether) copolymer.

2 . The poly(phenylene ether) resin composition according to claim 1 , wherein the weight-average molecular weight of the modified poly(phenylene ether) copolymer is in a range from 500 to 5000, inclusive.

3 . The poly(phenylene ether) resin composition according to claim 1 , wherein a substituent group expressed by Formula (A) is bonded to a terminal of the modified poly(phenylene ether),

where “n” is an integer in a range from 0 (zero) to 10, inclusive, “Z” is one of an arylene group and a carbonyl group when n=0 (zero), “Z” is the arylene group when “n” is in a range from 1 (one) to 10, inclusive, and each of R 1 to R 3 is independently one of a hydrogen atom and an alkyl group.

4 . The poly(phenylene ether) resin composition according to claim 1 , wherein the weight-average molecular weight of the polymer substance is in a range from 10,000 to 900,000, inclusive.

5 . The poly(phenylene ether) resin composition according to claim 1 , wherein the compound compatible with the modified poly(phenylene ether) copolymer is expressed by Formula (B),

where “m” is an integer in a range from 1 (one) to 3, inclusive, “n” is one of 0 (zero) and 1 (one), each of R 9 to R 11 is independently one of a hydrogen atom and an alkyl group, “X” is any one of an arylene group, a dicyclopentadienyl group, and an isocyanurate group, and “Y” is one of structures expressed by Formulas (C) and (D).

6 . The poly(phenylene ether) resin composition according to claim 1 , further comprising an inorganic filler.

7 . The poly(phenylene ether) resin composition according to claim 6 , wherein a content of the inorganic filler is in a range from 40 parts by mass to 250 parts by mass, inclusive, with respect to 100 parts by mass of a sum of contents of the modified poly(phenylene ether) copolymer, the polymer substance, and the compound compatible with the modified poly(phenylene ether) copolymer.

8 . The poly(phenylene ether) resin composition according to claim 1 , further comprising a phosphorus-based flame retardant.

9 . The poly(phenylene ether) resin composition according to claim 8 , wherein the phosphorus-based flame retardant is at least one selected from a phosphinate compound, a phosphoric ester compound, and a phosphazene compound.

10 . Prepreg comprising:
a substrate; and the poly(phenylene ether) resin composition according to claim 1 with which the substrate is impregnated.

11 . A metal-clad laminate comprising:
an insulating layer being a cured product of the prepreg according to claim 10 ; and metal foil disposed on the insulating layer.

12 . A printed-wiring board comprising:
an insulating layer being a cured product of the prepreg according to claim 10 ; and a conductive pattern disposed on the insulating layer.

Assignees

• Panasonic Ip Man Co Ltd

Inventors

• Umehara Hiroaki
• Inoue Hiroharu

Classifications

• H05K2201/0355

  Metal foils · CPC title

• H05K3/022

  Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates · CPC title

• H05K1/0353

  consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement · CPC title

• H05K2201/0209

  Inorganic, non-metallic particles · CPC title

• C08L71/126 Primary

  modified by chemical after-treatment · CPC title