Polyamide molding compound and use thereof

Patent metadata

Field	Value
Publication number	US-2016355679-A1
Application number	US-201415032978-A
Country	US
Kind code	A1
Filing date	Dec 16, 2014
Priority date	Dec 20, 2013
Publication date	Dec 8, 2016
Grant date	—

Abstract

Thermoplastic, flameproof plastic molding materials are described having improved mechanical properties and improved surface properties, in particular for use in LDS. The thermoplastic molding compound consists of: (A) 30-84.9% by weight of a thermoplastic polymer mixture, comprising (A1) 50-90% by weight of a partially aromatic, partially crystalline polyamide or a mixture of such polyamides; (A2) 5-50% by weight of a polyphenylether or a mixture of such polyphenylethers; (A3) 0-40% by weight of a partially crystalline, aliphatic polyamide, wherein (A1)-(A3) add up to 100% by weight of component (A); (B) 15-60% by weight of glass fibers; (C) 0.1%-10% by weight of a LDS additive or a mixture of LDS additives, wherein at least one LDS additive is composed entirely or partially of inorganic compounds of copper and/or tin; (D) 0-40% by weight of a particulate filler different from (C); (F) 0-5% by weight of other additional additives; wherein the sum of (A)-(E) amounts to 100% by weight.

First claim

1 . A thermoplastic molding composition consisting of:
(A) 30-84.9 wt % of a thermoplastic polymer mixture consisting of
(A1) 50-90 wt % of a semiaromatic, semicrystalline polyamide or of a mixture of such polyamides,
(A2) 5-50 wt % of a polyphenylene ether or of a mixture of such polyphenylene ethers,
(A3) 0-40 wt % of a semicrystalline, aliphatic polyamide or of a mixture of such polyamides,
(A1)-(A3) adding up to 100 wt % of component (A), with the proviso that the sum of (A2) and (A3) accounts for 10 to 50 wt % of component (A);
(B) 15-60 wt % of glass fibers; (C) 0.1-10 wt % of LDS additive or of a mixture of LDS additives, at least one LDS additive being composed wholly or partly of inorganic compounds of copper and/or of tin; (D) 0-40 wt % of particulate filler other than (C); (E) 0-5 wt % of further, different additives; the sum of (A)-(E) making up 100 wt %.

2 . The molding composition as claimed in claim 1 , wherein at least one of the components (A2) or (A3), are grafted.

3 . The molding composition as claimed in claim 1 , wherein the ratio of (A2) to (A3) is in the range from 4:1 to 1:4.

4 . The molding composition as claimed claim 1 , wherein the semicrystalline, aliphatic polymer of the components (A3) is selected from the group consisting of: polyamide 6, polyamide 10, polyamide 11, polyamide 12, polyamide 1212, polyamide 1012, polyamide 1210, polyamide 46, polyamide 66, polyamide 612, polyamide 126, polyamide 106, polyamide 610, polyamide 1010, polyamide 614, polyamide 618, polyamide 1014, polyamide 1018, polyamide 1214, polyamide 1218 and also copolyamides or mixtures thereof;
and/or wherein the fraction of component (A3) within the 100 wt % of component (A) is in the range of 5-40 wt %.

5 . The molding composition as claimed in claim 1 , wherein the fraction of component (A) is in the range of 55-90 wt % or 37-80.5 wt %, and/or wherein the fraction of component (B) is in the range of 18-55 wt %, based in on the sum of (A)-(E).

6 . The molding composition as claimed in claim 1 , wherein the polyphenylene ether of component (A2) is selected from the group consisting of the following: poly(2,6-diethyl-1,4-phenylene) ether, poly(2-methyl-6-ethyl-1,4-phenylene) ether, poly(2-methyl-6-propyl-1,4-phenylene) ether, poly(2,6-dipropyl-1,4-phenylene) ether, poly(2-ethyl-6-propyl-1,4-phenylene) ether or copolymers or mixtures thereof
and/or wherein the fraction of component (A2) within the 100 wt % of component (A) is in the range of 10-45 wt % or 10-46 wt %.

7 . The molding composition as claimed in claim 1 , wherein at least one of the polyphenylene ethers of component (A2) is grafted with maleic anhydride between 0.05 to 5%.

8 . The molding composition as claimed in claim 1 , wherein component (B) is a glass fiber of E glass with a circular cross section.

9 . The molding composition as claimed in claim 1 , wherein component (B) is a glass fiber or a mixture of glass fibers of E glass with a non-circular cross section.

10 . The molding composition as claimed in claim 1 , wherein component (B) is a high-strength glass fiber or a mixture of high-strength glass fibers with a circular or non-circular cross section and with a glass composition based essentially on the components silicon dioxide, aluminum oxide and magnesium oxide, with the fraction of magnesium oxide (MgO) being 5-15 wt % and the fraction of calcium oxide (CaO) being 0-10 wt %.

11 . The molding composition as claimed in claim 1 , wherein the semiaromatic, semicrystalline polyamide (A1) is formed from one or from a mixture of polyamides formed from:
(A1_a): 50-100 mol % of at least one of aromatic terephthalic acid and/or naphthalenedicarboxylic acid, based on the total amount of dicarboxylic acids present, 0 -50 mol % of an aliphatic dicarboxylic acid, and/or of a cycloaliphatic dicarboxylic acid and/or isophthalic acid; (A1_b): 80-100 mol % of at least one aliphatic diamine having 4-18 carbon atoms, based on the total amount of diamines present, 0-20 mol % of cycloaliphatic diamines, and/or araliphatic diamines, the percentage molar amount of dicarboxylic acids making 100% and the percentage molar amount of diamines making 100% in the polyamide (A1), and optionally from: (A1_c): aminocarboxylic acids and/or lactams.

12 . The molding composition as claimed in claim 1 , wherein the polyamide (A1) is selected from the group consisting of the following: PA 4T/41, PA 4T/61, PA 5T/5I, PA 6T/6, PA 6T/61, PA 6T/6I/6, PA 6T/66, 6T/610, 6T/612, PA 6T/10T, PA 6T/10I, PA 9T, PA 10T, PA 12T, PA 10T/10I, PA10T/106, PA10T/610, PA10T/612, PA10T/66, PA10T/6, PA10T/1010, PA10T/1012, PA10T/12, PA10T/11, PA 6T/9T, PA 6T/12T, PA 6T/10T/61, PA 6T/6I/6, PA 6T/61/12 and also mixtures thereof.

13 . The molding composition as claimed in claim 1 , wherein the fraction of component (C) is in the range of 0.5-8 wt %, based in each case on the sum of (A)-(E).

14 . The molding composition as claimed in claim 1 , wherein component (C) comprises at least one LDS additive based on copper and/or tin or is formed entirely by an LDS additive based on copper and/or tin, selected from the following group: metal oxide, metal phosphate, including basic metal phosphate and/or metal hydroxide phosphate.

15 . The molding composition as claimed in claim 1 , wherein component (C) is an LDS additive selected from the group consisting of the following: copper chromium oxide, copper oxide, copper hydroxide phosphate, tin hydroxide phosphate, tin phosphate, copper phosphate, basic copper phosphates and tin phosphates, or mixtures thereof.

16 . The molding composition as claimed in claim 1 , wherein the fraction of component (D) is in the range of 0-25 wt % based in each case on the sum of (A)-(E).

17 . The molding composition as claimed in claim 1 , wherein component (D) is an inorganic white pigment, or mixture of white pigments.

18 . A process for producing a molding composition as claimed in claim 1 , wherein in a first step component (A2) and/or component (A3), are grafted,
and subsequently in a second step this grafted component or these grafted components are combined and mixed with the remaining components (A1), (B) and (C) and also optionally (D) and/or (E).

19 . A component, based on a molding composition according to claim 1 .

20 . The molding composition as claimed in claim 1 , wherein a mixture of (A2) and (A3), are grafted, before being combined with the remaining components (A1), (B) and (C) and also optionally (D) and/or (E).

21 . The molding composition as claimed in claim 1 , wherein (A2) and/or (A3) are grafted with unsaturated anhydride, including maleic anhydride, itaconic anhydride, and/or with acrylic acid, methacrylic acid, maleic acid, monobutyl maleate, fumaric acid, aconitic acid or a mixture thereof.

22 . The molding composition as claimed in claim 21 , wherein, (A2) and/or (A3) are grafted in a degree of grafting in the range between 0.05 to 5 wt %, based on the weight of component (A2), of component (A3), or, in the case of the mixture, on the sum of (A2) and (A3).

23 . The molding composition as claimed in claim 21 , wherein, (A2) and/or (A3) are grafted in a degree of grafting in the range between 0.2 to 1.5 wt %, based the weight of component (A2), of component (A3), or, in the case of the mixture, on the sum of (A2) and (A3).

24 . The molding composition as claimed in claim 1 , wherein the ratio of (A1) to (A2) or of (A1) to the sum of (A

Assignees

• Ems Patent Ag

Inventors

• Aepli Etienne

Classifications

• C08K3/32

  Phosphorus-containing compounds · CPC title

• C08K2003/328

  Phosphates of heavy metals · CPC title

• C08K7/14

  Glass · CPC title

• C08K3/22

  of metals · CPC title

• C08K2201/003

  Additives being defined by their diameter · CPC title