Curable compositions which form interpenetrating polymer networks

US2016264769A1 · US · A1

Patent metadata
FieldValue
Publication numberUS-2016264769-A1
Application numberUS-201415032111-A
CountryUS
Kind codeA1
Filing dateOct 28, 2014
Priority dateOct 31, 2013
Publication dateSep 15, 2016
Grant date

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A curable composition comprising a a) styrene-butadiene vinyl resin containing from 30 weight percent to 85 weight percent of 1,2-vinyl groups and wherein styrene is present in an amount in the range of from 10 weight percent to 50 weight percent; b) a vinyl poly(phenylene ether) having a number average molecular weight in the range of from 300 to 10000; c) an aniline modified styrene-maleic anhydride copolymer; d) a multifunctional epoxy resin; and e) a flame retardant wherein, upon curing under curing conditions, the curable composition forms at least one interpenetrating network structure, is disclosed. Methods for preparing the curable composition are also disclosed, as are prepregs and laminates made therefrom.

First claim

Opening claim text (preview).

What is claimed is: 1 . A curable composition comprising a) a styrene-butadiene vinyl resin containing from 30 weight percent to 85 weight percent of 1, 2-vinyl groups and wherein styrene is present in an amount in the range of from 10 weight percent to 50 weight percent; b) a vinyl poly(phenylene ether) having a number average molecular weight in the range of from 300 to 10000; c) an aniline modified styrene-maleic anhydride copolymer; d) a multifunctional epoxy resin; and e) a flame retardant wherein, upon curing under curing conditions, the curable composition forms at least one interpenetrating network structure. 2 . A composition in accordance with claim 1 wherein the styrene-butadiene vinyl resin has a number average molecular weight in the range of from 500 to 8000. 3 . A curable composition according to claim 1 , further comprising a free radical initiator selected from the group consisting of 2,2′-azobisisobuytlnitrile, benzoyl peroxide, dicumyl peroxide, a disulfide, and combinations thereof. 4 . A curable composition according to claim 1 , further comprising a catalyst selected from the group consisting of 2-methyl imidazole, 2-phenyl imidazole, 2-ethyl-4-methyl imidazole, boric acid, triphenylphosphine, tetraphenylphosphonium-tetraphenylborate and mixtures thereof. 5 . A curable composition according to claim 1 , wherein the styrene-butadiene vinyl resin is present in an amount in the range of from 5 to 40 weight percent, the vinyl poly(phenylene ether) is present in an amount in the range of from 25 to 75 weight percent, the aniline modified styrene-maleic anhydride copolymer is present in an amount in the range of from 25 to 75 weight percent, and the multifunctional epoxy resin is present in an amount in the range of from 25 to 75 weight percent, based on the total weight of the curable composition. 6 . A curable composition according to claim 1 , wherein the flame retardant is present in an amount in the range of from 1 to 70 weight percent, based on the total weight of the styrene-butadiene vinyl resin and vinyl poly(phenylene ether). 7 . A curable composition in accordance with claim 2 wherein the free radical initiator is present in an amount in the range of from 0.01 weight percent to 10 weight percent, based on the total weight of the styrene-butadiene vinyl resin and vinyl poly(phenylene ether). 8 . A curable composition according to claim 1 , wherein the curing conditions comprise a curing temperature in the range of from 100° C. to 230° C. and a curing time in the range of from 1 minute to 200 minutes. 9 . A process comprising a) admixing i) a styrene-butadiene vinyl resin containing from 30 weight percent to 85 weight percent of 1,2-vinyl groups and wherein styrene is present in an amount in the range of from 10 weight percent to 50 weight percent; ii) a vinyl poly(phenylene ether) having a number average molecular weight in the range of from 800 to 10000; iii) an aniline modified styrene-maleic anhydride copolymer: iv) a multifunctional epoxy resin; and v) a flame retardant to form a curable composition and b) curing the curable composition under curing conditions to form a cured product having an interpenetrating polymer network. 10 . A process in accordance with claim 9 further comprising admixing in step a) a fre radical initiator selected from the group consisting of 2,2′-azobisisobuytlnitrile, benzoyl peroxide, dicumyl peroxide, a disulfide, and combinations thereof. 11 . A process according to claim 9 , wherein the styrene-butadiene vinyl resin is present in the curable composition in an amount in the range of from 5 to 40 weight percent, the vinyl poly(phenylene ether) is present in an amount in the range of from 25 to 75 weight percent, the aniline modified SMA is present in an amount in the range of from 25 to 75 weight percent, and the multifunctional epoxy resin is present in an amount in the range of from 25 to 75 weight percent, based on the total weight of the curable composition. 12 . A process according to claim 9 , wherein the flame retardant is present in the curable composition in an amount in the range of from 1 to 70 weight percent, based on the total weight of the styrene-butadiene vinyl resin and the vinyl poly(phenylene ether). 13 . A process in accordance with claim 10 wherein the free radical initiator is present in the curable composition in an amount in the range of from 0.01 weight percent to 10 weight percent, based on the total weight of the styrene-butadiene vinyl resin and the vinyl poly(phenylene ether). 14 . A process according to claim 9 , wherein the curing conditions comprise a curing temperature of from130° C. to 160° C. and a curing time of from 2 minutes to 6 minutes. 15 . A prepreg prepared from the curable composition of claim 1 . 16 . An electrical laminate prepared from the curable composition of claim 1 . 17 . A printed circuit board prepared from the curable composition of claim 1 . 18 . A curable composition according to claim 2 , further comprising a free radical initiator selected from the group consisting of 2,2′-azobisisobuytlnitrile, benzoyl peroxide, dicumyl peroxide, a disulfide, and combinations thereof and a catalyst selected from the group consisting of 2-methyl imidazole, 2-phenyl imidazole, 2-ethyl-4-methyl imidazole, boric acid, triphenylphosphine, tetraphenylphosphonium-tetraphenylborate and mixtures thereof. 19 . A curable composition according to claim 2 , wherein the styrene-butadiene vinyl resin is present in an amount in the range of from 5 to 40 weight percent, the vinyl poly(phenylene ether) is present in an amount in the range of from 25 to 75 weight percent, the aniline modified styrene- maleic anhydride copolymer is present in an amount in the range of from 25 to 75 weight percent, and the multifunctional epoxy resin is present in an amount in the range of from 25 to 75 weight percent, based on the total weight of the curable composition and the flame retardant is present in an amount in the range of from 1 to 70 weight percent, based on the total weight of the styrene-butadiene vinyl resin and vinyl poly(phenylene ether). 20 . A curable composition according to claim 2 , further comprising a free radical initiator selected from the group consisting of 2,2′-azobisisobuytlnitrile, benzoyl peroxide, dicumyl peroxide, a disulfide, and combinations thereof, and the free radical initiator is present in an amount in the range of from 0.01 weight percent to 10 weight percent, based on the total weight of the styrene-butadiene vinyl resin and vinyl poly(phenylene ether).

Assignees

Inventors

Classifications

  • containing four or more polymers in a blend · CPC title

  • Flame or fire retardant/resistant · CPC title

  • use in coating or encapsulating of electronic parts · CPC title

  • Polyphenylene oxides · CPC title

  • containing interpenetrating networks · CPC title

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What does patent US2016264769A1 cover?
A curable composition comprising a a) styrene-butadiene vinyl resin containing from 30 weight percent to 85 weight percent of 1,2-vinyl groups and wherein styrene is present in an amount in the range of from 10 weight percent to 50 weight percent; b) a vinyl poly(phenylene ether) having a number average molecular weight in the range of from 300 to 10000; c) an aniline modified styrene-maleic an…
Who is the assignee on this patent?
Blue Cube Ip Llc
What technology area does this patent fall under?
Primary CPC classification C08L25/16. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Thu Sep 15 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).