Substrate cleaning apparatus, substrate cleaning system, substrate cleaning method and memory medium

Patent metadata

Field	Value
Publication number	US-2016163534-A1
Application number	US-201615041273-A
Country	US
Kind code	A1
Filing date	Feb 11, 2016
Priority date	Aug 7, 2012
Publication date	Jun 9, 2016
Grant date	—

Abstract

A method for cleaning a substrate includes setting a substrate inside a cleaning chamber, supplying on a surface of the substrate a treatment solution which includes a volatile component and forms a treatment film, vaporizing the volatile component of the treatment solution supplied on the surface of the substrate such that the treatment solution solidifies or is cured on the surface of the substrate and the treatment film is formed on the surface of the substrate, and supplying onto the treatment film formed on the surface of the substrate a removal solution which removes the treatment film.

First claim

1 . A method for cleaning a substrate, comprising:
setting a substrate inside a cleaning chamber; supplying on a surface of the substrate a treatment solution which includes a volatile component and forms a treatment film; vaporizing the volatile component of the treatment solution supplied on the surface of the substrate such that the treatment solution solidifies or is cured on the surface of the substrate and the treatment film is formed on the surface of the substrate; and supplying onto the treatment film formed on the surface of the substrate a removal solution which removes the treatment film.

2 . The method for cleaning a substrate according to claim 1 , wherein the supplying of the treatment solution and the supplying of the removal solution are conducted in the cleaning chamber, and the substrate is not transferred between the supplying of the treatment solution and the supplying of the removal solution.

3 . The method for cleaning a substrate according to claim 1 , further comprising accelerating vaporization of the volatile component of the treatment solution supplied on the surface of substrate.

4 . The method for cleaning a substrate according to claim 1 , further comprising supplying a solvent which has affinity to the treatment solution.

5 . The method for cleaning a substrate according to claim 1 , wherein the treatment solution includes a synthetic resin.

6 . The method for cleaning a substrate according to claim 1 , wherein the treatment solution further includes a chemical solution which dissolves foreign matter attached on the substrate or material deposited on the substrate.

7 . The method for cleaning a substrate according to claim 5 , wherein the synthetic resin is an acrylic resin or a phenolic resin.

8 . The method for cleaning a substrate according to claim 5 , wherein the synthetic resin is at least one resin selected from the group consisting of epoxy resin, melanin resin, urea resin, unsaturated polyester resin, alkyd resin, polyurethane, polyimide, polyethylene, polypropylene, polyvinylidene chloride, polystyrene, polyvinyl acetate, polytetrafluoroethylene, acrylonitrile butadiene styrene resin, styrene acrylonitrile resin, polyamide, nylon, polyacetal, polycarbonate, denatured polyphenylene ether, polybutylene terephthalate, polyethylene terephthalate, polyphenylene sulfide, polysulfone, polyether ether ketone, and polyamideimide.

9 . The method for cleaning a substrate according to claim 1 , wherein the removal solution is an alkaline solution.

10 . The method for cleaning a substrate according to claim 1 , wherein the removal solution includes at least one solution selected from the group consisting of ammonium, tetramethyl ammonium hydroxide and choline.

11 . The method for cleaning a substrate according to claim 2 , further comprising accelerating vaporization of the volatile component of the treatment solution supplied on the surface of substrate.

12 . The method for cleaning a substrate according to claim 2 , further comprising supplying a solvent which has affinity to the treatment solution.

13 . The method for cleaning a substrate according to claim 2 , wherein the treatment solution includes a synthetic resin.

14 . The method for cleaning a substrate according to claim 2 , wherein the treatment solution further includes a chemical solution which dissolves foreign matter attached on the substrate or material deposited on the substrate.

15 . The method for cleaning a substrate according to claim 13 , wherein the synthetic resin is an acrylic resin or a phenolic resin.

16 . The method for cleaning a substrate according to claim 13 , wherein the synthetic resin is at least one resin selected from the group consisting of epoxy resin, melanin resin, urea resin, unsaturated polyester resin, alkyd resin, polyurethane, polyimide, polyethylene, polypropylene, polyvinylidene chloride, polystyrene, polyvinyl acetate, polytetrafluoroethylene, acrylonitrile butadiene styrene resin, styrene acrylonitrile resin, polyamide, nylon, polyacetal, polycarbonate, denatured polyphenylene ether, polybutylene terephthalate, polyethylene terephthalate, polyphenylene sulfide, polysulfone, polyether ether ketone, and polyamideimide.

17 . The method for cleaning a substrate according to claim 2 , wherein the removal solution is an alkaline solution.

18 . The method for cleaning a substrate according to claim 2 , wherein the removal solution includes at least one solution selected from the group consisting of ammonium, tetramethyl ammonium hydroxide and choline.

19 . The method for cleaning a substrate according to claim 1 , further comprising:
accelerating vaporization of the volatile component of the treatment solution supplied on the surface of substrate; and supplying a solvent which has affinity to the treatment solution.

20 . The method for cleaning a substrate according to claim 1 , further comprising:
accelerating vaporization of the volatile component of the treatment solution supplied on the surface of substrate; and supplying a solvent which has affinity to the treatment solution, wherein the treatment solution includes a synthetic resin.

Assignees

• Tokyo Electron Ltd

Inventors

• Kaneko Miyako
• Orii Takehiko
• Shimura Satoru
• Yamashita Masami
• Kanno Itaru

Classifications

• H10P72/7608

  characterised by a plurality of separate clamping members, e.g. clamping fingers · CPC title

• H10P72/0448

  Apparatus for applying a liquid, a resin, an ink or the like · CPC title

• H10P72/0424

  using mainly spraying means, e.g. nozzles · CPC title

• H10P72/0414

  using mainly spraying means, e.g. nozzles · CPC title

• H10P70/20 Primary

  Cleaning during device manufacture · CPC title