Method for manufacturing metal-filled microstructure

Patent metadata

Field	Value
Publication number	US-2016153104-A1
Application number	US-201615019370-A
Country	US
Kind code	A1
Filing date	Feb 9, 2016
Priority date	Aug 30, 2013
Publication date	Jun 2, 2016
Grant date	—

Abstract

An object of the present invention is to provide a method for manufacturing a metal-filled microstructure, capable of easily filling micropores with metal and suppressing the generation of residual stress caused by metal filling. A method for manufacturing a metal-filled microstructure according to the present invention includes: an anodic oxidation treatment step of anodically oxidizing a single surface of an aluminum substrate to form an anodic oxidation film on the single surface of the aluminum substrate, the anodic oxidation film including micropores, which are present in a thickness direction, and a barrier layer which is present in a bottom portion of the micropores; a barrier layer removal step of removing the barrier layer of the anodic oxidation film after the anodic oxidation treatment step; a metal filling step of filling the inside of the micropores with metal through an electroplating treatment after the barrier layer removal step; and a substrate removal step of removing the aluminum substrate to obtain a metal-filled microstructure after the metal filling step.

First claim

What is claimed is:

1 . A method for manufacturing a metal-filled microstructure. the method comprising:
an anodic oxidation treatment step of anodically oxidizing a single surface of an aluminum substrate to form an anodic oxidation film on the single surface of the aluminum substrate, the anodic oxidation film including micropores, which are present in a thickness direction, and a barrier layer which is present in a bottom portion of the micropores; a barrier layer removal step of removing the barrier layer of the anodic oxidation film after the anodic oxidation treatment step; a metal filling step of filling the inside of the micropores with metal through an electroplating treatment after the barrier layer removal step; and a substrate removal step of removing the aluminum substrate to obtain a metal-filled microstructure after the metal filling step.

2 . The method for manufacturing a metal-filled microstructure according to claim 1 ,
wherein in the barrier layer removal step, the barrier layer is electrochemically dissolved at a potential lower than that in the anodic oxidation treatment of the anodic oxidation treatment step.

3 . The method for manufacturing a metal-filled microstructure according to claim 1 , wherein in the barrier layer removal step, the barrier layer is removed by etching.

4 . The method for manufacturing a metal-filled microstructure according to claim 1 ,
wherein in the barrier layer removal step, the barrier layer is removed by etching after being electrochemically dissolved at a potential lower than that in the anodic oxidation treatment of the anodic oxidation treatment step.

5 . The method for manufacturing a metal-filled microstructure according to claim 1 , further comprising:
a mask layer forming step of forming a mask layer having a desired shape in advance on a single surface of the aluminum substrate to be anodically oxidized before the anodic oxidation treatment step.

6 . The method for manufacturing a metal-filled microstructure according to claim 2 , further comprising:
a mask layer forming step of forming a mask layer having a desired shape in advance on a single surface of the aluminum substrate to be anodically oxidized before the anodic oxidation treatment step.

7 . The method for manufacturing a metal-filled microstructure according to claim 3 , further comprising:
a mask layer forming step of forming a mask layer having a desired shape in advance on a single surface of the aluminum substrate to be anodically oxidized before the anodic oxidation treatment step.

8 . The method for manufacturing a metal-filled microstructure according to claim 4 , further comprising:
a mask layer forming step of forming a mask layer having a desired shape in advance on a single surface of the aluminum substrate to be anodically oxidized before the anodic oxidation treatment step.

9 . The method for manufacturing a metal-filled microstructure according to claim 1 , further comprising:
a film attachment step of attaching a peelable adhesive layer-attached film to a surface of the anodic oxidation film including the micropores filled with the metal before the substrate removal step and after the metal filling step; and a film peeling step of peeling off the adhesive layer-attached film after the substrate removal step.

10 . The method for manufacturing a metal-filled microstructure according to claim 2 , further comprising:
a film attachment step of attaching a peelable adhesive layer-attached film to a surface of the anodic oxidation film including the micropores filled with the metal before the substrate removal step and after the metal filling step: and a film peeling step of peeling off the adhesive layer-attached film after the substrate removal step.

11 . The method for manufacturing a metal-filled microstructure according to claim 3 , further comprising:
a film attachment step of attaching a peelable adhesive layer-attached film to a surface of the anodic oxidation film including the micropores filled with the metal before the substrate removal step and after the metal filling step; and a film peeling step of peeling off the adhesive layer-attached film after the substrate removal step.

12 . The method for manufacturing a metal-filled microstructure according to claim 4 , further comprising:
a film attachment step of attaching a peelable adhesive layer-attached film to a surface of the anodic oxidation film including the micropores filled with the metal before the substrate removal step and after the metal filling step; and a film peeling step of peeling off the adhesive layer-attached film after the substrate removal step.

13 . The method for manufacturing a metal-filled microstructure according to claim 5 , further comprising:
a polishing step of polishing a surface of the anodic oxidation film including the micropores filled with the metal and a surface of the mask layer to remove at least the mask layer after the metal filling step.

14 . The method for manufacturing a metal-filled microstructure according to claim 9 , further comprising:
a polishing step of polishing a surface of the anodic oxidation film including the micropores filled with the metal and a surface of the mask layer to remove at least the mask layer after the metal filling step.

15 . The method for manufacturing a metal-filled microstructure according to claim 1 , further comprising:
a surface smoothing step of smoothing the surface, in contact with the aluminum substrate, of the anodic oxidation film including the micropores filled with the metal after the substrate removal step.

16 . The method for manufacturing a metal-filled microstructure according to claim 2 , further comprising:
a surface smoothing step of smoothing the surface, in contact with the aluminum substrate, of the anodic oxidation film including the micropores filled with the metal after the substrate removal step.

17 . The method for manufacturing a metal-filled microstructure according to claim 3 , further comprising:
a surface smoothing step of smoothing the surface, in contact with the aluminum substrate, of the anodic oxidation film including the micropores filled with the metal after the substrate removal step.

18 . The method for manufacturing a metal-filled microstructure according to claim 4 , further comprising:
a surface smoothing step of smoothing the surface, in contact with the aluminum substrate, of the anodic oxidation film including the micropores filled with the metal after the substrate removal step.

19 . The method for manufacturing a metal-filled microstructure according to claim 5 , further comprising:
a surface smoothing step of smoothing the surface, in contact with the aluminum substrate, of the anodic oxidation film including the micropores filled with the metal after the substrate removal step.

20 . The method for manufacturing a metal-filled microstructure according to claim 9 , further comprising:
a surface smoothing step of smoothing the surface, in contact with the aluminum substrate, of the anodic oxidation film including the micropores filled with the metal after the substrate removal step.

Assignees

• Fujifilm Corp

Inventors

• Yamashita Kosuke

Classifications

• H10W72/013

  of die-attach connectors · CPC title

• C25D1/10 Primary

  Moulds; Masks; Masterforms · CPC title

• H01L24/27

  Electricity · mapped topic

• C25D1/20 Primary

  Separation of the formed objects from the electrodes {with no destruction of said electrodes} · CPC title

• H05K3/32

  electrically connecting electric components or wires to printed circuits · CPC title