Manufacturing method of metal mask and mask for deposition using thereof

Patent metadata

Field	Value
Publication number	US-2016289854-A1
Application number	US-201514864924-A
Country	US
Kind code	A1
Filing date	Sep 25, 2015
Priority date	Mar 31, 2015
Publication date	Oct 6, 2016
Grant date	—

Abstract

A mask manufacturing method, including manufacturing a first mold, including forming first patterns having inclined surfaces by patterning a silicon substrate; manufacturing a second mold, including forming second patterns that correspond to the first patterns by coating and curing a hardener on a surface of the first mold in which the first patterns are formed; separating the second mold from the first mold; forming a mask pattern by coating a metal layer on the second mold; and separating the metal layer from the second mold.

First claim

What is claimed is:

1 . A mask manufacturing method, comprising:
manufacturing a first mold, including forming first patterns having inclined surfaces by patterning a silicon substrate; manufacturing a second mold, including forming second patterns that correspond to the first patterns by coating and curing a hardener on a surface of the first mold in which the first patterns are formed; separating the second mold from the first mold; forming a mask pattern by coating a metal layer on the second mold; and separating the metal layer from the second mold.

2 . The mask manufacturing method as claimed in claim 1 , wherein:
the first patterns are concave patterns, and the second patterns are protruding patterns.

3 . The mask manufacturing method as claimed in claim 1 , wherein a thickness of the metal layer is smaller than a thickness of the second patterns.

4 . The mask manufacturing method as claimed in claim 1 , wherein:
the silicon substrate is an anisotropic silicon substrate, and in manufacturing the first mold, anisotropic etching is performed on the silicon substrate.

5 . The mask manufacturing method as claimed in claim 4 , wherein the silicon substrate is formed of a (100)-oriented silicon substrate.

6 . The mask manufacturing method as claimed in claim 1 , wherein each first pattern has a triangular-shaped cross-section having one open side.

7 . The mask manufacturing method as claimed in claim 1 , wherein each first pattern has a trapezoid-shaped cross-section having one open side.

8 . The mask manufacturing method as claimed in claim 1 , wherein the hardener includes a thermosetting resin.

9 . The mask manufacturing method as claimed in claim 8 , wherein, in manufacturing the second mold, a carrier substrate is layered above the hardener.

10 . The mask manufacturing method as claimed in claim 1 , wherein the hardener includes a photosensitive resin.

11 . The mask manufacturing method as claimed in claim 10 , wherein, in manufacturing the second mold, a light transmissive electric conductive layer and a carrier substrate are sequentially layered above the hardener.

12 . The mask manufacturing method as claimed in claim 1 , wherein:
two or more first patterns are formed in the silicon substrate at a distance from each other, and two or more second patterns are disposed at locations corresponding to the first patterns.

13 . The mask manufacturing method as claimed in claim 12 , wherein, in separating the second mold, spaces between neighboring second patterns are opened by performing an etching process on the hardener.

14 . The mask manufacturing method as claimed in claim 1 , wherein the metal layer is formed through an electro-forming coating process.

15 . A mask for deposition, manufactured using a mask manufacturing method as claimed in claim 1 and having mask patterns formed therein,
wherein the mask pattern is gradually narrowed toward a rear plane of the mask from a front plane of the mask.

16 . The mask as claimed in claim 15 , wherein a shape of the mask pattern viewed from the front plane is a rectangular-shaped cross-section.

17 . The mask as claimed in claim 15 , wherein the shape of the mask pattern viewed from the front plane is a rectangular shape.

Assignees

• Samsung Display Co Ltd

Inventors

• Han Jeong Won

Classifications

• B05B15/0437

  Operations & Transport · mapped topic

• C25D1/10 Primary

  Moulds; Masks; Masterforms · CPC title

• B05C21/005

  Masking devices (stencils B05C17/06; masking devices for which the means for applying liquids or other fluent material is spraying or is not important B05B12/20) · CPC title