Package structure and method of manufacturing the same
US-2024105664-A1 · Mar 28, 2024 · US
Electricity
Electricity · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H01L24/27 |
| Official title | — |
| Display label | Electricity (mapped technology topic) |
| Total patents | 1,899 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is stable.
| Year | Patents |
|---|---|
| 2015 | 139 |
| 2016 | 154 |
| 2017 | 194 |
| 2018 | 205 |
| 2019 | 203 |
| 2020 | 216 |
| 2021 | 163 |
| 2022 | 148 |
| 2023 | 146 |
| 2024 | 168 |
| 2025 | 134 |
| 2026 | 29 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Integrated Circuit Packaging Method Using Pre-Applied Attachment Medium
US-2015371930-A1 · Dec 24, 2015 · US
Molding material and method for packaging semiconductor chips
US-9209152-B2 · Dec 8, 2015 · US
Solder Coated Clip And Integrated Circuit Packaging Method
US-2015348881-A1 · Dec 3, 2015 · US
Semiconductor device and method of forming adhesive layer over insulating layer for bonding carrier to mixed surfaces of semiconductor die and encapsulant
US-2015348861-A1 · Dec 3, 2015 · US
Laminated film and use thereof
US-9202795-B2 · Dec 1, 2015 · US
Methods for forming semiconductor device packages
US-9202714-B2 · Dec 1, 2015 · US
Methods for producing a bond and a semiconductor module
US-9202800-B2 · Dec 1, 2015 · US
Integrated bondline spacers for wafer level packaged circuit devices
US-9187312-B2 · Nov 17, 2015 · US
Packaged integrated circuit devices with through-body conductive vias, and methods of making same
US-2015325554-A1 · Nov 12, 2015 · US
Semiconductor device and method of forming adhesive layer over insulating layer for bonding carrier to mixed surfaces of semiconductor die and encapsulant
US-9184104-B1 · Nov 10, 2015 · US
Adhesive composition, adhesive sheet and production process for semiconductor device
US-9184082-B2 · Nov 10, 2015 · US
Integrated bondline spacers for wafer level packaged circuit devices
US-9174836-B2 · Nov 3, 2015 · US
Integrated circuit, a chip package and a method for manufacturing an integrated circuit
US-9165792-B2 · Oct 20, 2015 · US
Method for ternary wafer bonding and structure thereof
US-2015294950-A1 · Oct 15, 2015 · US
Integrated circuit package and method of making same
US-2015287699-A1 · Oct 8, 2015 · US
Semiconductor device
US-2015270137-A1 · Sep 24, 2015 · US
Coreless integrated circuit packaging system and method of manufacture thereof
US-9142530-B2 · Sep 22, 2015 · US
Semiconductor device
US-9142493-B2 · Sep 22, 2015 · US
Stacked type power device module
US-9142473-B2 · Sep 22, 2015 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC H01L24/27?
- CPC H01L24/27 is the Cooperative Patent Classification code for “Electricity.”
- How many patents are filed under CPC H01L24/27 (Electricity)?
- Our database includes 1,899 publications tagged with this CPC code.
- Is patent activity under CPC H01L24/27 growing?
- Publication counts under this code: 168 in 2024 vs 134 in 2025 (latest complete years).