Substrate support assembly having rapid temperature control

Patent metadata

Field	Value
Publication number	US-2016135252-A1
Application number	US-201614997529-A
Country	US
Kind code	A1
Filing date	Jan 16, 2016
Priority date	Jul 20, 2006
Publication date	May 12, 2016
Grant date	—

Abstract

A substrate support assembly comprises a ceramic puck having a substrate receiving surface and an opposing backside surface. The ceramic puck has an electrode and a heater embedded therein. The heater comprises first and second coils that are radially spaced apart. A base of the support assembly comprises a channel to circulate fluid therethrough, the channel comprising an inlet and terminus that are adjacent to one another so that the channel loops back upon itself. A compliant layer bonds the ceramic puck to the base.

First claim

What is claimed is:

1 . A substrate support assembly capable of holding and heating a substrate in a process chamber, the assembly comprising:
(a) a ceramic puck comprising a substrate receiving surface and an opposing backside surface, the ceramic puck comprising (i) an electrode embedded in the ceramic puck to generate an electrostatic force to retain a substrate placed on the substrate receiving surface, and (ii) a heater embedded in the ceramic puck to heat the substrate, the heater comprising first and second heater coils that are radially spaced apart; (b) a base comprising a channel to circulate fluid therethrough, the channel comprising an inlet and terminus that are adjacent to one another so that the channel loops back upon itself; and (c) a compliant layer bonding the ceramic puck to the base.

2 . A support assembly according to claim 1 wherein the opposing backside surface of the ceramic puck comprises a plurality of spaced apart mesas, with first mesas adjacent to the inlet of the channel and second mesas that being distal from the inlet of the channel, and wherein the first mesas are spaced apart a first distance that is smaller than a second distance between the second mesas.

3 . A support assembly according to claim 1 wherein the opposing backside surface of the ceramic puck comprises a plurality of spaced apart mesas, with first mesas adjacent to the inlet of the channel and second mesas that being distal from the inlet of the channel, and wherein the first mesas have a first contact area that is larger than a second contact area of the second mesas.

4 . A support assembly according to claim 1 wherein the ceramic puck comprises a thickness that is less than about 7 mm.

5 . A support assembly according to claim 1 wherein the compliant layer comprises (i) silicon having embedded aluminum fibers, or (ii) acrylic having an embedded wire mesh.

6 . A support assembly according to claim 1 further comprising a controller configured to:
(i) independently apply different electrical power levels to the first and second heater coils;
(ii) control the temperature and flow rate of fluid passed through the channel of the base;
(iii) receive temperature signals from a temperature sensor; and
(iv) serve as a feedback control loop to adjust the power applied to the first and second heater coils and the flow of fluid through the channel of the base in response to the temperature signals from the temperature sensor.

7 . A support assembly according to claim 6 wherein the controller comprises code to (i) increase a fluid temperature in the base to a higher level prior to ramping up the electrical power levels applied to the heater in the ceramic puck, or (ii) decrease a fluid temperature in the base to a lower level prior to ramping down the electrical power levels applied to the heater in the ceramic puck.

8 . A support assembly according to claim 6 wherein the temperature sensor comprises a plurality of optical temperature sensors to measure the temperatures of overlying central and peripheral portions of a substrate.

9 . A support assembly according to claim 8 wherein the optical temperature sensors include a first sensor positioned at a central heating zone of the ceramic puck and a second sensor positioned at a peripheral heating zone of the ceramic puck.

10 . A support assembly according to claim 1 wherein the ceramic puck comprises a thickness of less than about 7 mm.

11 . A support assembly according to claim 1 wherein the ceramic puck is composed of aluminum oxide.

12 . A support assembly according to claim 1 where the first coil is located at a peripheral portion of the ceramic puck and the second coil is located at a central portion of the ceramic puck, and wherein the first and second coils are concentric about one another.

13 . A support assembly according to claim 1 wherein the first coil comprises first loops spaced apart a first distance, and the second coil comprises second loops spaced apart a second distance that is greater than the first distance.

14 . A support assembly according to claim 13 wherein the second loops are positioned about a lift pin hole in the ceramic puck.

15 . A substrate support assembly capable of holding and heating a substrate in a process chamber, the assembly comprising:
(a) a ceramic puck comprising a substrate receiving surface and an opposing backside surface, the ceramic puck comprising:
(i) an electrode embedded in the ceramic puck to generate an electrostatic force to retain a substrate placed on the substrate receiving surface; and
(ii) a heater embedded in the ceramic puck to heat the substrate, the heater comprising first and second heater coils that are radially spaced apart; and
(iii) wherein the opposing backside surface of the ceramic puck comprises a plurality of spaced apart mesas, with first mesas adjacent to an inlet of a channel and second mesas that being distal from the inlet of the channel, the first mesas being spaced apart a first distance that is smaller than a second distance between the second mesas;
(b) a base comprising the channel to circulate fluid therethrough, the channel comprising an inlet and terminus that are adjacent to one another so that the channel loops back upon itself; and (c) a compliant layer bonding the ceramic puck to the base.

16 . A support assembly according to claim 15 wherein the first mesas have a first contact area that is larger than a second contact area of the second mesas.

17 . A support assembly according to claim 15 where the first coil is located at a peripheral portion of the ceramic puck and the second coil is located at a central portion of the ceramic puck, and wherein the first and second coils are concentric about one another.

18 . A support assembly according to claim 15 wherein the first coil comprises first loops spaced apart a first distance, and the second coil comprises second loops spaced apart a second distance that is greater than the first distance.

Assignees

• Applied Materials Inc

Inventors

• Matyushkin Alexander
• Katz Dan
• Holland John
• Panagopoulos Theodoros
• Willwerth Michael D

Classifications

• H10P72/722

  Details of electrostatic chucks · CPC title

• H10P72/0602

  Temperature monitoring · CPC title

• H10P72/0434 Primary

  mainly by convection · CPC title

• H10P72/72

  using electrostatic chucks · CPC title

• B05C13/00

  Means for manipulating or holding work, e.g. for separate articles {(B05C1/0821 takes precedence)} · CPC title