Substrate correction device, substrate lamination device, substrate processing system, substrate correction method, substrate processing method, and semiconductor device manufacturing method
US-2024404859-A1 · Dec 5, 2024 · US
Dry non-plasma treatment system
US2015314313A1 · US · A1
| Field | Value |
|---|---|
| Publication number | US-2015314313-A1 |
| Application number | US-201514800509-A |
| Country | US |
| Kind code | A1 |
| Filing date | Jul 15, 2015 |
| Priority date | Jun 22, 2006 |
| Publication date | Nov 5, 2015 |
| Grant date | — |
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Abstract
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A dry non-plasma treatment system for removing material is described. The treatment system is configured to provide chemical treatment of one or more substrates, wherein each substrate is exposed to a gaseous chemistry under controlled conditions including surface temperature and gas pressure. Furthermore, the treatment system is configured to provide thermal treatment of each substrate, wherein each substrate is thermally treated to remove the chemically treated surfaces on each substrate.
First claim
Opening claim text (preview).
1 . A system for removing material on a substrate, comprising: a process chamber configured to contain a substrate and configured to facilitate a non-plasma environment; a temperature controlled substrate holder mounted within the process chamber, and configured to support the substrate such that a surface of the substrate is oriented to be treated by the non-plasma environment, and configured to control a temperature of the substrate when the substrate is resting on an upper surface of the t…
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Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
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- What does patent US2015314313A1 cover?
- A dry non-plasma treatment system for removing material is described. The treatment system is configured to provide chemical treatment of one or more substrates, wherein each substrate is exposed to a gaseous chemistry under controlled conditions including surface temperature and gas pressure. Furthermore, the treatment system is configured to provide thermal treatment of each substrate, wherei…
- Who is the assignee on this patent?
- Tokyo Electron Ltd
- What technology area does this patent fall under?
- Primary CPC classification H10P95/00. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Thu Nov 05 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).