Wafer processing method
US-2024395620-A1 · Nov 28, 2024 · US
Wafer Taping Scheme
US2015155195A1 · US · A1
| Field | Value |
|---|---|
| Publication number | US-2015155195-A1 |
| Application number | US-201314093221-A |
| Country | US |
| Kind code | A1 |
| Filing date | Nov 29, 2013 |
| Priority date | Nov 29, 2013 |
| Publication date | Jun 4, 2015 |
| Grant date | — |
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Abstract
Official abstract text for this publication.
A method includes setting a first tension value of a laminating tape during a standby mode. A second tension value of the laminating tape is set during taping on a wafer. The second tension value is different from the first tension value. A third tension value of the laminating tape is set after taping. The third tension value is different from the second tension value.
First claim
Opening claim text (preview).
What is claimed is: 1 . A method, comprising: setting a first tension value of a laminating tape during a standby mode; setting a second tension value of the laminating tape during taping on a wafer, wherein the second tension value is different from the first tension value; and setting a third tension value of the laminating tape after taping, wherein the third tension value is different from the second tension value. 2 . The method of claim 1 , fur…
Assignees
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Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
- H10P72/7402Primary
Electricity · mapped topic
Cross-Sectional Technologies · mapped topic
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Frequently asked questions
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- What does patent US2015155195A1 cover?
- A method includes setting a first tension value of a laminating tape during a standby mode. A second tension value of the laminating tape is set during taping on a wafer. The second tension value is different from the first tension value. A third tension value of the laminating tape is set after taping. The third tension value is different from the second tension value.
- Who is the assignee on this patent?
- Taiwan Semiconductor Mfg
- What technology area does this patent fall under?
- Primary CPC classification H10P72/7402. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Thu Jun 04 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).