Embedding electronic devices using electrochemical additive manufacturing

Patent metadata

Field	Value
Publication number	US-12595579-B2
Application number	US-202318165200-A
Country	US
Kind code	B2
Filing date	Feb 6, 2023
Priority date	Sep 6, 2022
Publication date	Apr 7, 2026
Grant date	Apr 7, 2026

Abstract

An electrochemical additive manufacturing method includes coupling a first electronic device to a build plate and positioning the build plate into an electrolyte solution. The method also includes positioning a deposition anode array into the electrolyte solution, connecting the cathode portion of the build plate and one or more deposition anodes of the abide array to a power source. The method also includes transmitting electrical energy from the power source, through the one or more deposition anodes, through the electrolyte solution, and to the cathode portion of the build plate, such that material is deposited onto the cathode portion and forms at least a sidewall of a shell that encases the first electronic device against the build plate when the first electronic device is coupled to the build plate. The shell and the first electronic device form a second electronic device.

First claim

What is claimed is:

1 . An electrochemical additive manufacturing method, comprising steps of:
coupling a first electronic device to a build plate; positioning the build plate into an electrolyte solution such that a cathode portion of the build plate directly contacts the electrolyte solution; positioning a deposition anode array, comprising a plurality of deposition anodes, into the electrolyte solution such that a gap is established between the cathode portion and the deposition anode array; connecting the cathode portion of the build plate to a power source; connecting one or more deposition anodes of the plurality of deposition anodes to the power source; and transmitting electrical energy from the power source, through the one or more deposition anodes of the plurality of deposition anodes, through the electrolyte solution, and to the cathode portion of the build plate, such that material is deposited onto the cathode portion and forms at least a sidewall of a shell that encases the first electronic device against the build plate when the first electronic device is coupled to the build plate, wherein the shell and the first electronic device form a second electronic device; wherein:
the step of coupling the first electronic device to the build plate occurs after the step of transmitting the electrical energy from the power source through the one or more deposition anodes of the plurality of deposition anodes, through the electrolyte solution, and to the cathode portion of the build plate, such that material is deposited onto the cathode portion;
the material deposited onto the cathode portion also forms a receptacle; and
the step of coupling the first electronic device to the build plate comprises inserting the first electronic device into the receptacle.

2 . The electrochemical additive manufacturing method according to claim 1 , wherein the material forms an entirety of the shell that encases the first electronic device against the build plate.

3 . The electrochemical additive manufacturing method according to claim 1 , further comprising applying a second material onto the sidewall and over the first electronic device to form a top of the shell.

4 . The electrochemical additive manufacturing method according to claim 1 , further comprising removing the second electronic device from the build plate.

5 . The electrochemical additive manufacturing method according to claim 1 , wherein the step of coupling the first electronic device to the build plate comprises adhering the first electronic device to the build plate with an adhesive.

6 . The electrochemical additive manufacturing method according to claim 5 , wherein:
the adhesive is a hardenable material that is hardendable from a pliable state to a hardened state; the step of coupling the first electronic device to the build plate comprising attaching the first electronic device to the build plate with the adhesive when the adhesive is in the pliable state; and the electrochemical manufacturing method further comprises, after the material is deposited onto the cathode portion, hardening the adhesive from the pliable state to the hardened state.

7 . The electrochemical additive manufacturing method according to claim 1 , wherein:
the build plate comprises an aperture; and the step of coupling the first electronic device to the build plate comprises positioning the first electronic device within the aperture.

8 . The electrochemical additive manufacturing method according to claim 1 , wherein the first electronic device forms a fixed fit with the receptacle.

9 . The electrochemical additive manufacturing method according to claim 1 , further comprising forming weep holes in the sidewall of the shell, wherein insertion of the first electronic device into the receptacle urges a portion of the electrolyte solution, located within the receptacle, out of the receptacle through the weep holes.

10 . The electrochemical additive manufacturing method according to claim 9 , wherein the weep holes are formed by selective deposition of the material onto the cathode portion.

11 . The electrochemical additive manufacturing method according to claim 9 , wherein the weep holes are formed by removing portions of the material after the material is deposited onto the cathode portion.

12 . The electrochemical additive manufacturing method according to claim 1 , wherein:
the build plate comprises a substrate, made of one of an electrically non-conductive material or a semiconductor material; and the cathode portion is fixed to the substrate.

13 . The electrochemical additive manufacturing method according to claim 1 , wherein the first electronic device comprises a sensing device.

14 . The electrochemical additive manufacturing method according to claim 1 , wherein:
the material deposited onto the cathode portion comprises multiple layers; the steps of positioning the build plate and positioning the deposition anode array into the electrolyte solution comprises adjusting a size of the gap established between the cathode portion and the deposition anode array from a first distance to a second distance, greater than the first distance; a first layer of the multiple layers of the material is deposited onto the cathode portion when the gap is at the first distance; and a second layer of the multiple layers of the material is deposited onto the first layer of the multiple layers of the material when the gap is at the second distance.

15 . An electrochemical additive manufacturing method, comprising steps of:
coupling a first electronic device to a build plate; positioning the build plate into an electrolyte solution such that a cathode portion of the build plate directly contacts the electrolyte solution; positioning a deposition anode array, comprising a plurality of deposition anodes, into the electrolyte solution such that a gap is established between the cathode portion and the deposition anode array; connecting the cathode portion of the build plate to a power source; connecting one or more deposition anodes of the plurality of deposition anodes to the power source; and transmitting electrical energy from the power source, through the one or more deposition anodes of the plurality of deposition anodes, through the electrolyte solution, and to the cathode portion of the build plate, such that material is deposited onto the cathode portion and forms at least a sidewall of a shell that encases the first electronic device against the build plate when the first electronic device is coupled to the build plate, wherein the shell and the first electronic device form a second electronic device; wherein the step of coupling the first electronic device to the build plate occurs before the step of transmitting the electrical energy from the power source through the one or more deposition anodes of the plurality of deposition anodes, through the electrolyte solution, and to the cathode portion of the build plate, such that material is deposited onto the cathode portion.

16 . The electrochemical additive manufacturing method according to claim 15 , wherein the material is deposited onto the cathode portion in direct contact with the first electronic device.

17 . The electrochemical additive manufacturing method according to claim 15 , wherein the material is deposited onto the cathode portion such that a gap is defined between the material and the first electronic device.

18 . The electrochemical additive manufacturing method according to claim 15 , wherein:
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Assignees

• Fabric8Labs Inc

Inventors

• Pain David
• Edmonds Andrew

Classifications

• B33Y10/00

  Processes of additive manufacturing · CPC title

• C25D1/003 Primary

  3D structures, e.g. superposed patterned layers · CPC title