Reflector plate for substrate processing

Patent metadata

Field	Value
Publication number	US-12588456-B2
Application number	US-202217903964-A
Country	US
Kind code	B2
Filing date	Sep 6, 2022
Priority date	Sep 6, 2022
Publication date	Mar 24, 2026
Grant date	Mar 24, 2026

Abstract

A reflector plate assembly for processing a substrate includes a reflector plate having a first surface, wherein the first surface is a bare polished surface, a reflector disk embedded within the reflector plate from the first surface, a coating layer on the reflector disk, and a pyrometer disposed through an opening of the reflector disk.

First claim

What is claimed is:

1 . A reflector plate assembly for processing a substrate, comprising:
a reflector plate having a first surface, wherein the first surface is a bare, polished, uncoated surface; a reflector disk embedded within the reflector plate from the first surface; a coating layer on the reflector disk; and a pyrometer disposed through an opening of the reflector disk.

2 . The reflector plate assembly of claim 1 , wherein the reflector plate comprises aluminum or aluminum alloy.

3 . The reflector plate assembly of claim 1 , wherein the reflector disk comprises aluminum, quartz, or stainless steel.

4 . The reflector plate assembly of claim 1 , wherein the coating layer comprises gold (Au).

5 . The reflector plate assembly of claim 1 , wherein the coating layer comprises chromium (Cr).

6 . The reflector plate assembly of claim 1 , wherein the coating layer comprises silver (Ag).

7 . The reflector plate assembly of claim 1 , further comprising:
an encapsulating layer on the coating layer.

8 . The reflector plate assembly of claim 7 , wherein the encapsulating layer comprises silicon oxide (SiO 2 ).

9 . The reflector plate assembly of claim 7 , wherein the encapsulating layer comprises sapphire.

10 . A reflector plate assembly for processing a substrate, comprising:
a reflector plate having a first surface, wherein the first surface is a bare, polished, uncoated surface; a reflector disk embedded within the reflector plate from the first surface; a coating layer on the reflector disk; a pyrometer disposed through an opening of the reflector disk; and an encapsulating layer on the coating layer.

11 . The reflector plate assembly of claim 10 , wherein the reflector plate comprises aluminum.

12 . The reflector plate assembly of claim 10 , wherein the reflector disk comprises aluminum or quartz.

13 . The reflector plate assembly of claim 10 , wherein the coating layer comprises gold (Au), chromium (Cr), or silver (Ag).

14 . The reflector plate assembly of claim 10 , wherein the encapsulating layer comprises silicon oxide (SiO 2 ).

15 . The reflector plate assembly of claim 10 , wherein the encapsulating layer comprises sapphire.

16 . A chamber for processing a substrate, comprising:
a chamber body; a chamber lid disposed on the chamber body, the chamber lid comprising:
a lid body; and
a reflector plate assembly, the reflector plate assembly, comprising:
a reflector plate having a first surface, wherein the first surface is a bare, polished, uncoated surface;
a plurality of reflector disks embedded within the reflector plate from the first surface;
a coating layer on each reflector disk of the plurality of reflector disks;
a plurality of pyrometers, wherein each pyrometer of the plurality of pyrometers is disposed through an opening of a reflector disk of the plurality of reflector disks; and
an encapsulating layer on the coating layer.

17 . The chamber of claim 16 , further comprising a plurality of zones in which a plurality of lamps are divided, wherein each pyrometer of the plurality of pyrometers corresponds to each zone of the plurality of zones.

18 . The chamber of claim 17 , further comprising a controller, the controller configured to receive outputs from the plurality of pyrometers and to control voltage supplied to the plurality of lamps.

19 . The chamber of claim 16 , further comprising a substrate support, the substrate support comprising a plurality of zones to heat a substrate positioned on the substrate support, wherein each pyrometer of the plurality of pyrometers corresponds to each zone of the plurality of zones.

20 . The chamber of claim 19 , further comprising a plurality of resistive heat elements, wherein a resistive heat element is disposed within each zone and the plurality of resistive heating elements are controlled by the pyrometer of each zone.

Assignees

• Applied Materials Inc

Inventors

• Iu Dongming
• Wu Jian

Classifications

• H10P72/0602

  Temperature monitoring · CPC title

• H10P72/0432 Primary

  mainly by conduction · CPC title

• H10P72/0436 Primary

  mainly by radiation · CPC title

• H01L21/67248

  Electricity · mapped topic

• H01L21/67103

  Electricity · mapped topic