Method of making semiconductor device having a thermal contact
US-2025062179-A1 · Feb 20, 2025 · US
Wu Jian is listed as an inventor on 13 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Wu Jian |
| Total patents | 13 |
| First publication | Mar 3, 2022 |
| Latest publication | Feb 20, 2025 |
Publications ranked by popularity score, then publication date.
US-2025062179-A1 · Feb 20, 2025 · US
US-12142542-B2 · Nov 12, 2024 · US
US-12094799-B2 · Sep 17, 2024 · US
US-12040358-B2 · Jul 16, 2024 · US
US-11973083-B2 · Apr 30, 2024 · US
US-11862527-B2 · Jan 2, 2024 · US
US-2023395606-A1 · Dec 7, 2023 · US
US-2023386958-A1 · Nov 30, 2023 · US
US-2023387196-A1 · Nov 30, 2023 · US
US-2022384296-A1 · Dec 1, 2022 · US
Latest publications not already listed above.
US-2022271058-A1 · Aug 25, 2022 · US
US-2022165637-A1 · May 26, 2022 · US
US-2022069074-A1 · Mar 3, 2022 · US
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Taiwan Semiconductor Mfg Co Ltd | 13 |
| Tsmc China Company Ltd | 10 |
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10D84/859 | 10 |
| H10D84/038 | 10 |
| H10D86/201 | 10 |
| H01L27/1203 | 10 |
| H10W70/023 | 7 |