Bump Structure and Method of Forming Same
US-2015357301-A1 · Dec 10, 2015 · US
changes in materials
changes in materials · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H10W72/07255 |
| Official title | {changes in materials} |
| Display label | changes in materials |
| Total patents | 945 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is declining.
| Year | Patents |
|---|---|
| 2015 | 78 |
| 2016 | 92 |
| 2017 | 105 |
| 2018 | 79 |
| 2019 | 99 |
| 2020 | 90 |
| 2021 | 87 |
| 2022 | 93 |
| 2023 | 77 |
| 2024 | 71 |
| 2025 | 61 |
| 2026 | 13 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Semiconductor devices and methods of manufacture thereof
US-9209140-B2 · Dec 8, 2015 · US
Bump including diffusion barrier bi-layer and manufacturing method thereof
US-9209122-B2 · Dec 8, 2015 · US
Mounting structure and mounting method
US-9204551-B2 · Dec 1, 2015 · US
Semiconductor bonding structure
US-9196595-B2 · Nov 24, 2015 · US
Method of Forming Solder Bump, and Solder Bump
US-2015333027-A1 · Nov 19, 2015 · US
Method of forming post-passivation interconnect structure
US-2015325539-A1 · Nov 12, 2015 · US
Conductive connections, structures with such connections, and methods of manufacture
US-2015325543-A1 · Nov 12, 2015 · US
Metal Bump Joint Structure and Methods of Forming
US-2015325547-A1 · Nov 12, 2015 · US
Conductive contacts having varying widths and method of manufacturing same
US-2015325542-A1 · Nov 12, 2015 · US
Electroplated solder with eutectic chemical composition
US-2015318254-A1 · Nov 5, 2015 · US
Device packaging with substrates having embedded lines and metal defined pads
US-2015318238-A1 · Nov 5, 2015 · US
Semiconductor structure and manufacturing method thereof
US-2015279793-A1 · Oct 1, 2015 · US
Manufacture of coated copper pillars
US-2015279797-A1 · Oct 1, 2015 · US
Integrated circuit package
US-2015262920-A1 · Sep 17, 2015 · US
Method for bonding wafers and structure of bonding part
US-9136232-B2 · Sep 15, 2015 · US
Electroplated solder for high-temperature interconnect
US-9136237-B2 · Sep 15, 2015 · US
Semiconductor device and method for manufacturing same
US-9129840-B2 · Sep 8, 2015 · US
Solder bump joining structure with low resistance joining member
US-9129884-B2 · Sep 8, 2015 · US
Joining a chip to a substrate with solder alloys having different reflow temperatures
US-2015243625-A1 · Aug 27, 2015 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC H10W72/07255?
- CPC H10W72/07255 is the Cooperative Patent Classification code for “changes in materials.”
- How many patents are filed under CPC H10W72/07255 (changes in materials)?
- Our database includes 945 publications tagged with this CPC code.
- Is patent activity under CPC H10W72/07255 growing?
- Publication counts under this code: 71 in 2024 vs 61 in 2025 (latest complete years).