Advanced Solder Alloys For Electronic Interconnects

Patent metadata

Field	Value
Publication number	US-2018102464-A1
Application number	US-201615286759-A
Country	US
Kind code	A1
Filing date	Oct 6, 2016
Priority date	Oct 6, 2016
Publication date	Apr 12, 2018
Grant date	—

Abstract

Improved electrical and thermal properties of solder alloys are achieved by the use of micro-additives in solder alloys to engineer the electrical and thermal properties of the solder alloys and the properties of the reaction layers between the solder and the metal surfaces. The electrical and thermal conductivity of alloys and that of the reaction layers between the solder and the -metal surfaces can be controlled over a wide range of temperatures. The solder alloys produce stable microstructures wherein such stable microstructures of these alloys do not exhibit significant changes when exposed to changes in temperature, compared to traditional interconnect materials.

First claim

1 . A lead-free, antimony-free solder alloy comprising:
(a) 10 wt. % or less of silver (b) 10 wt. % or less of bismuth (c) 3 wt. % or less of copper (d) at least one of the following elements
up to 1 wt. % of nickel
up to 1 wt. % of titanium
up to 1 wt. % of cobalt
up to 3.5 wt. % of indium
up to 1 wt. % of zinc
up to 1 wt. % of cerium
(e) optionally one or more of the following elements
0 to 1 wt. % of manganese
0 to 1 wt. % of chromium
0 to 1 wt. % of germanium
0 to 1 wt. % of iron
0 to 1 wt. % of aluminum
0 to 1 wt. % of phosphorus
0 to 1 wt. % of gold
0 to 1 wt. % of gallium
0 to 1 wt. % of tellurium
0 to 1 wt. % of selenium
0 to 1 wt. % of calcium
0 to 1 wt. % of vanadium
0 to 1 wt. % of molybdenum
0 to 1 wt. % of platinum
0 to 1 wt. % of magnesium
0 to 1 wt. % of rare earths
(f) the balance tin, together with any unavoidable impurities.

2 . A lead-free, solder alloy comprising:
(a) 10 wt. % or less of silver (b) 10 wt. % or less of bismuth (c) 3 wt. % or less of copper (d) 4 wt % or less of antimony (e) at least one of the following elements
up to 1 wt % of Ni
up to 1 wt. % of titanium
up to 1 wt. % of cobalt
up to 3.5 wt. % of indium
up to 1 wt. % of zinc
up to 1 wt. % of cerium
(f) optionally one or more of the following elements
0 to 1 wt. % of manganese
0 to 1 wt. % of chromium
0 to 1 wt. % of germanium
0 to 1 wt. % of iron
0 to 1 wt. % of aluminum
0 to 1 wt. % of phosphorus
0 to 1 wt. % of gold
0 to 1 wt. % of gallium
0 to 1 wt. % of tellurium
0 to 1 wt. % of selenium
0 to 1 wt. % of calcium
0 to 1 wt. % of vanadium
0 to 1 wt. % of molybdenum
0 to 1 wt. % of platinum
0 to 1 wt. % of magnesium
0 to 1 wt. % of rare earths
(g) the balance tin, together with any unavoidable impurities.

3 . The lead-free, antimony-free solder alloy of claim 1 , wherein the alloy has melting point of from 200 to 222° C.

4 . The lead-free solder alloy of claim 2 , wherein the alloy has melting point of from 200 to 222° C.

5 . The solder alloy of claim 1 , wherein the alloy is in the form of a stick, a solid or flux cored wire, a foil or strip, or a powder or paste (powder plus flux blend), or solder spheres for use in ball grid array joints or chip scale packages, or other pre-formed solder pieces, with or without a flux core or a flux coating.

6 . The solder alloy of claim 2 , wherein the alloy is in the form of a stick, a solid or flux cored wire, a foil or strip, or a powder or paste (powder plus flux blend), or solder spheres for use in ball grid array joints or chip scale packages, or other pre-formed solder pieces, with or without a flux core or a flux coating.

7 . The solder alloy of claim 1 , wherein the alloy comprises nickel.

8 . The solder alloy of claim 1 , wherein the alloy comprises cerium.

9 . A soldered joint comprising a lead-free, antimony-free solder alloy comprising:
(a) 10 wt. % or less of silver (b) 10 wt. % or less of bismuth (c) 3 wt. % or less of copper (d) at least one of the following elements
up to 1 wt. % of nickel
up to 1 wt. % of titanium
up to 1 wt. % of cobalt
up to 3.5 wt. % of indium
up to 1 wt. % of zinc
up to 1 wt. % of cerium
(e) optionally one or more of the following elements
0 to 1 wt. % of manganese
0 to 1 wt. % of chromium
0 to 1 wt. % of germanium
0 to 1 wt. % of iron
0 to 1 wt. % of aluminum
0 to 1 wt. % of phosphorus
0 to 1 wt. % of gold
0 to 1 wt. % of gallium
0 to 1 wt. % of tellurium
0 to 1 wt. % of selenium
0 to 1 wt. % of calcium
0 to 1 wt. % of vanadium
0 to I wt. % of molybdenum
0 to 1 wt. % of platinum
0 to 1 wt. % of magnesium
0 to 1 wt. % of rare earths
(f) the balance tin, together with any unavoidable impurities.

10 . A soldered joint comprising a lead-free solder alloy comprising:
(a) 10 wt. % or less of silver (b) 10 wt. % or less of bismuth (c) 3 wt. % or less of copper (d) 4 wt. % or less of antimony (e) at least one of the following elements
up to 1 wt. % of nickel
up to 1 wt. % of titanium
up to 1 wt. % of cobalt
up to 3.5 wt. % of indium
up to 1 wt. % of zinc
up to 1 wt. % of cerium
(f) optionally one or more of the following elements
0 to 1 wt. % of manganese
0 to 1 wt. % of chromium
0 to 1 wt. % of germanium
0 to 1 wt. % of iron
0 to 1 wt. % of aluminum
0 to 1 wt. % of phosphorus
0 to 1 wt. % of gold
0 to 1 wt. % of gallium
0 to 1 wt. % of tellurium
0 to 1 wt. % of selenium
0 to 1 wt. % of calcium
0 to 1 wt. % of vanadium
0 to 1 wt. % of molybdenum
0 to 1 wt. % of platinum
0 to 1 wt. % of magnesium
0 to 1 wt. % of rare earths
(g) the balance tin, together with any unavoidable impurities.

11 . A method of soldering, the method comprising the steps of:
a) applying a solder alloy to a substrate, wherein the solder is a lead free or a lead-free, antimony free solder alloy; wherein the solder can be applied by wave soldering, Surface Mount Technology (SMT) soldering, die attach soldering, thermal interface soldering, hand soldering, laser and RF induction soldering, rework soldering, lamination, and combinations thereof.

12 . The method according to claim 11 , wherein the lead-free, antimony-free solder alloy comprises:
(a) 10 wt. % or less of silver (b) 10 wt. % or less of bismuth (c) 3 wt. % or less of copper (d) at least one of the following elements
up to 1 wt. % of nickel
up to 1 wt. % of titanium
up to 1 wt. % of cobalt
up to 3.5 wt. % of indium
up to 1 wt. % of zinc
up to 1 wt. % of cerium
(e) optionally one or more of the following elements
0 to 1 wt. % of manganese
0 to 1 wt. % of chromium
0 to 1 wt. % of germanium
0 to 1 wt. % of iron
0 to 1 wt. % of aluminum
0 to 1 wt. % of phosphorus
0 to 1 wt. % of gold
0 to 1 wt. % of gallium
0 to 1 wt. % of tellurium
0 to 1 wt. %a of selenium
0 to 1 wt. % of calcium
0 to 1 wt. % of vanadium
0 to 1 wt. % of molybdenum
0 to 1 wt. % of platinum
0 to 1 wt. % of magnesium
0 to 1 wt. % of rare earths
(f) the balance tin, together with any unavoidable impurities.

13 . The method according to claim 11 , wherein the substrate is a printed circuit board, flexible substrate, a metal core circuit board, a leadframe, a direct bond copper on Al 2 O 3 or AlN.

14 . The method according to claim 11 , wherein the substrate is an LED component, LED die, and LED package, a high power switch, a high power amplifier or any other electronic component.

15 . The method according to claim 14 , wherein the LED component exhibits less than 5% change in CCT over 1500 temperature cycles.

16 . The method according to claim 11 , wherein the solder alloy has a thermal conductivity drop of less than 10% when the temperature of the alloy reaches 150° C.

17 . The method according to claim 11 , wherein the electrical resistivity of the solder alloy increases less than 20% when the temperature of the alloy reaches 85° C.

18 . The method according to claim according to claim 14 , wherein the LED with the solder alloy applied exhibits at least 10% higher luminous efficacy compared to an LED with SAC305.

19 . The method according to claim 14 wherein the LED with the solder alloy applied shows a smaller drop in luminous flux during temperature cycling compared to an LED with SAC305.

20 . The method according to claim 14 , wherein the solder is applied to the LED using die attach.

Assignees

• Alpha Assembly Solutions Inc

Inventors

• De Avila Ribas Morgana
• Choudhury Pritha
• Sarkar Siuli
• Pandher Ranjit
• Herrick Nicholas G
• Patel Amit
• Bhatkal Ravindra M
• Singh Bawa

Classifications

• H10W72/952

  comprising metals or metalloids, e.g. PbSn, Ag or Cu · CPC title

• H10W72/353

  not comprising solid metals or solid metalloids, e.g. ceramics · CPC title

• H10W72/352

  comprising metals or metalloids, e.g. solders · CPC title

• H10W72/351

  Materials of die-attach connectors · CPC title

• H10W72/325

  Die-attach connectors having a filler embedded in a matrix · CPC title