Solder alloy, solder paste, solder ball, resin flux-cored solder and solder joint
US-2021001431-A1 · Jan 7, 2021 · US
Solder alloy, joint portion, joining material, solder paste, joint structure, and electronic control device
US12569940B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-12569940-B2 |
| Application number | US-202318342733-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jun 28, 2023 |
| Priority date | Aug 24, 2022 |
| Publication date | Mar 10, 2026 |
| Grant date | Mar 10, 2026 |
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- Title
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- Abstract
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Abstract
Official abstract text for this publication.
A solder alloy includes 45 mass % or more and 63 mass % or less of Bi, 0.1 mass % or more and less than 0.7 mass % of Sb, 0.05 mass % or more and 1 mass % or less of In, and a balance including Sn.
First claim
Opening claim text (preview).
What is claimed is: 1 . A solder alloy consisting of: 45 mass % or more and 63 mass % or less of Bi; 0.1 mass % or more and less than 0.7 mass % of Sb; 0.05 mass % or more and 1 mass % or less of In; and optionally one or more selected from P, Ga, and Ge in a total amount of 0.001 mass % or more and 0.05 mass % or less; optionally one or more selected from Mn, Ti, Al, Cr, V, and Mo in a total amount of 0.001 mass % or more and 0.05 mass % or less; and a balance including Sn. 2 . The solder alloy according to claim 1 , wherein a liquidus temperature of the solder alloy is 170° C. or lower. 3 . A joining material comprising: a solder alloy consisting of: 45 mass % or more and 63 mass % or less of Bi; 0.1 mass % or more and less than 0.7 mass % of Sb; 0.05 mass % or more and 1 mass % or less of In; optionally one or more selected from P, Ga, and Ge in a total amount of 0.001 mass % or more and 0.05 mass % or less; optionally one or more selected from Mn, Ti, Al, Cr, V, and Mo in a total amount of 0.001 mass % or more and 0.05 mass % or less; and a balance including Sn. 4 . The joining material according to claim 3 , wherein a liquidus temperature of the solder alloy is 170° C. or lower. 5 . A solder paste comprising: a flux; and a powder made of a solder alloy consisting of: 45 mass % or more and 63 mass % or less of Bi; 0.1 mass % or more and less than 0.7 mass % of Sb; 0.05 mass % or more and 1 mass % or less of In; and optionally one or more selected from P, Ga, and Ge in a total amount of 0.001 mass % or more and 0.05 mass % or less; optionally one or more selected from Mn, Ti, Al, Cr, V, and Mo in a total amount of 0.001 mass % or more and 0.05 mass % or less; and a balance including Sn. 6 . The solder paste according to claim 5 , wherein a liquidus temperature of the solder alloy is 170° C. or lower. 7 . A joint portion formed using the solder alloy according to claim 1 . 8 . A joint portion formed using the joining material according to claim 3 . 9 . A joint portion formed using the solder paste according to claim 5 . 10 . A joint structure comprising: a first joining target material; a second joining target material; and a joint portion formed using the solder alloy according to claim 1 to join the first joining target material and the second joining target material. 11 . A joint structure comprising: a first joining target material; a second joining target material; and a joint portion formed using the joining material according to claim 5 to join the first joining target material and the second joining target material. 12 . A joint structure comprising: a first joining target material; a second joining target material; and a joint portion formed using the solder paste according to claim 5 to join the first joining target material and the second joining target material. 13 . An electronic control device comprising: a joint structure comprising: a first joining target material; a second joining target material; and a joint portion formed using the solder alloy according to claim 1 to join the first joining target material and the second joining target material. 14 . An electronic control device comprising: a joint structure comprising: a first joining target material; a second joining target material; and a joint portion formed using the joining material according to claim 3 to join the first joining target material and the second joining target material. 15 . An electronic control device comprising: a joint structure comprising: a first joining target material; a second joining target material; and a joint portion formed using the solder paste according to claim 5 to join the first joining target material and the second joining target material.
Assignees
Inventors
Classifications
Alloys based on antimony or bismuth · CPC title
Bi as the principal constituent · CPC title
Pastes, creams or slurries · CPC title
- C22C13/02Primary
with antimony or bismuth as the next major constituent · CPC title
by soldering · CPC title
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Frequently asked questions
Answers are generated from the same data shown on this page.
- What does patent US12569940B2 cover?
- A solder alloy includes 45 mass % or more and 63 mass % or less of Bi, 0.1 mass % or more and less than 0.7 mass % of Sb, 0.05 mass % or more and 1 mass % or less of In, and a balance including Sn.
- Who is the assignee on this patent?
- Tamura Seisakusho Kk
- What technology area does this patent fall under?
- Primary CPC classification C22C13/02. Mapped technology areas include Chemistry & Metallurgy.
- When was this patent published?
- Publication date Tue Mar 10 2026 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 3 related publications on this page (citations in our corpus or others sharing the same primary CPC).