Solder alloy, joint portion, joining material, solder paste, joint structure, and electronic control device
US-12569940-B2 · Mar 10, 2026 · US
Maruyama Daisuke is listed as an inventor on 72 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Maruyama Daisuke |
| Total patents | 72 |
| First publication | Sep 1, 2015 |
| Latest publication | Mar 10, 2026 |
Publications ranked by popularity score, then publication date.
US-12569940-B2 · Mar 10, 2026 · US
US-12545135-B2 · Feb 10, 2026 · US
US-12328385-B2 · Jun 10, 2025 · US
US-2024393759-A1 · Nov 28, 2024 · US
US-2024313951-A1 · Sep 19, 2024 · US
US-12020592-B2 · Jun 25, 2024 · US
US-11971696-B2 · Apr 30, 2024 · US
US-2024066638-A1 · Feb 29, 2024 · US
US-2024019492-A1 · Jan 18, 2024 · US
US-11822696-B2 · Nov 21, 2023 · US
Latest publications not already listed above.
US-2023302937-A1 · Sep 28, 2023 · US
US-11725950-B2 · Aug 15, 2023 · US
US-11693054-B2 · Jul 4, 2023 · US
US-2023147297-A1 · May 11, 2023 · US
US-2023129473-A1 · Apr 27, 2023 · US
US-11526623-B2 · Dec 13, 2022 · US
US-2022390516-A1 · Dec 8, 2022 · US
US-2022317648-A1 · Oct 6, 2022 · US
US-11372330-B2 · Jun 28, 2022 · US
US-2022128367-A1 · Apr 28, 2022 · US
US-2022067198-A1 · Mar 3, 2022 · US
US-11215206-B2 · Jan 4, 2022 · US
US-11148053-B2 · Oct 19, 2021 · US
US-11120589-B2 · Sep 14, 2021 · US
US-11042746-B2 · Jun 22, 2021 · US
US-10983743-B2 · Apr 20, 2021 · US
US-2021102563-A1 · Apr 8, 2021 · US
US-10948039-B2 · Mar 16, 2021 · US
US-10936568-B2 · Mar 2, 2021 · US
US-10926360-B2 · Feb 23, 2021 · US
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| IBM | 44 |
| Nsk Ltd | 6 |
| Toyota Jidoshokki Kk | 6 |
| Fujitsu Ltd | 5 |
| Keyence Co Ltd | 5 |
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| G06T11/26 | 13 |
| G06T11/206 | 12 |
| G06F3/0482 | 11 |
| G06F3/04842 | 8 |
| G06F3/04817 | 8 |