Contribution incrementality machine learning models
US-2026044428-A1 · Feb 12, 2026 · US
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Jiao Yang patents
Jiao Yang is listed as an inventor on 47 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Jiao Yang |
| Total patents | 47 |
| First publication | Nov 12, 2015 |
| Latest publication | Feb 12, 2026 |
Notable patents
Publications ranked by popularity score, then publication date.
Metal organic frameworks (MOFS) filler for enabling low CTE and low dielectric constant PCB
US-12532412-B2 · Jan 20, 2026 · US
System and method for implementing gpu multi-tag cache architecture
US-2025383990-A1 · Dec 18, 2025 · US
BGA stiffener attachment with low Eolife adhesive strength at high solder joint stress area generated from enabling load
US-12494441-B2 · Dec 9, 2025 · US
Contribution incrementality machine learning models
US-12481571-B2 · Nov 25, 2025 · US
Electron catalyzed molecular recognition
US-2025192191-A1 · Jun 12, 2025 · US
Erosion-shielded turbine blades and methods of manufacturing the same
US-12129769-B2 · Oct 29, 2024 · US
Additive manufacturing system with partially flexible build platform
US-2024316647-A1 · Sep 26, 2024 · US
Contribution incrementality machine learning models
US-2024248825-A1 · Jul 25, 2024 · US
Erosion-shielded turbine blades and methods of manufacturing the same
US-2024229653-A9 · Jul 11, 2024 · US
Recent patents
Latest publications not already listed above.
Contribution incrementality machine learning models
US-11983089-B2 · May 14, 2024 · US
Erosion-shielded turbine blades and methods of manufacturing the same
US-2024133299-A1 · Apr 25, 2024 · US
Funding-based management of cloud resources
US-2024095094-A1 · Mar 21, 2024 · US
Machine-learning model & interface for planning, predicting, and implementing cloud resource systems
US-2024095095-A1 · Mar 21, 2024 · US
Efficient inter-chip interconnect topology for distributed parallel deep learning
US-11922219-B2 · Mar 5, 2024 · US
Bga stiffener attachment with low eolife adhesive strength at high solder joint stress area generated from enabling load
US-2023307379-A1 · Sep 28, 2023 · US
Metal organic frameworks (mofs) filler for enabling low cte and low dielectric constant pcb
US-2023309220-A1 · Sep 28, 2023 · US
Method and apparatus for execution of neural network
US-11768911-B2 · Sep 26, 2023 · US
Parallel dataflow routing scheme systems and methods
US-2023244626-A1 · Aug 3, 2023 · US
Systems and methods for parallel processing
US-2023185749-A1 · Jun 15, 2023 · US
Data reuse and efficient processing scheme in executing convolutional neural network
US-11663446-B2 · May 30, 2023 · US
Efficient inter-chip interconnect topology for distributed parallel deep learning
US-2023153164-A1 · May 18, 2023 · US
Switch mode power supply system
US-2023122886-A1 · Apr 20, 2023 · US
Hyper-square implementation of tree AllReduce algorithm for distributed parallel deep learning
US-11620502-B2 · Apr 4, 2023 · US
Efficient and more advanced implementation of ring-allreduce algorithm for distributed parallel deep learning
US-2023088237-A1 · Mar 23, 2023 · US
Efficient inter-chip interconnect topology for distributed parallel deep learning
US-11561840-B2 · Jan 24, 2023 · US
Efficient and more advanced implementation of ring-AllReduce algorithm for distributed parallel deep learning
US-11520640-B2 · Dec 6, 2022 · US
Conformable heat sink interface with a high thermal conductivity
US-11464139-B2 · Oct 4, 2022 · US
Multi-size convolutional layer background
US-2021357730-A1 · Nov 18, 2021 · US
Three-dimensional porous graphene foam material to prepare bone defect filler
US-2021343998-A1 · Nov 4, 2021 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Alibaba Group Holding Ltd | 14 |
| Samsung Electronics Co Ltd | 6 |
| Intel Corp | 6 |
| Google Llc | 5 |
| Ge Infrastructure Technology Llc | 2 |
Top CPC classifications
Most common classification codes across this inventor's patents.