Integration of microdevices into system substrate
US-2020013662-A1 · Jan 9, 2020 · US
Offset alignment and repair in micro device transfer
US12482686B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-12482686-B2 |
| Application number | US-202318390304-A |
| Country | US |
| Kind code | B2 |
| Filing date | Dec 20, 2023 |
| Priority date | Mar 30, 2020 |
| Publication date | Nov 25, 2025 |
| Grant date | Nov 25, 2025 |
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- Title
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Abstract
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This invention relates to the process of correcting misalignment and filling voids after a microdevice transfer process. The process involves transfer heads, measurement of offset and misalignment in horizontal, vertical, and rotational errors. An execution of the new offset vector for the next transfer corrects the alignment.
First claim
Opening claim text (preview).
The invention claimed is: 1 . A method to populate void micro devices, the method comprising: generating a map of the void microdevices; forming a new pad on top of an existing pad on a system substrate for any void microdevices in the map wherein the new pad is taller than the existing pad; aligning a microdevice on a donor substrate with the new pad; transferring the aligned micro device to the new pad; and securing the transferred micro device by the new pad. 2 . The method of claim 1 , wherein the new pad is used to transfer a new microdevice into a void position in the system substrate. 3 . The method of claim 1 , wherein after the transfer, the transferred microdevice is pushed down to get at a same proximity height of other adjacent microdevices. 4 . The method of claim 1 , wherein the new pad on top of existing pad is of soft materials, the soft materials include one or more of polymers and nano particles. 5 . The method of claim 1 , wherein the microdevice is pushed down by a force during the transfer to avoid interfering with already transferred microdevices. 6 . The method of claim 5 , wherein the push force is created mechanically, optically, or by heat.
Assignees
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Classifications
batch processes · CPC title
for alignment · CPC title
Package configurations · CPC title
Connecting or disconnecting · CPC title
of die-attach connectors · CPC title
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Frequently asked questions
Answers are generated from the same data shown on this page.
- What does patent US12482686B2 cover?
- This invention relates to the process of correcting misalignment and filling voids after a microdevice transfer process. The process involves transfer heads, measurement of offset and misalignment in horizontal, vertical, and rotational errors. An execution of the new offset vector for the next transfer corrects the alignment.
- Who is the assignee on this patent?
- Vuereal Inc
- What technology area does this patent fall under?
- Primary CPC classification H10W46/00. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Nov 25 2025 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 12 related publications on this page (citations in our corpus or others sharing the same primary CPC).