Repairing method, manufacturing method, device and electronic apparatus of micro-LED

Patent metadata

Field	Value
Publication number	US-10020420-B2
Application number	US-201515529602-A
Country	US
Kind code	B2
Filing date	Aug 18, 2015
Priority date	Aug 18, 2015
Publication date	Jul 10, 2018
Grant date	Jul 10, 2018

Abstract

A repairing method, manufacturing method, device and electronic apparatus of micro-LED are disclosed. The method for repairing micro-LED defects comprises: obtaining a micro-LED defect pattern on a receiving substrate; forming micro-LEDs ( 703 b ) corresponding to the defect pattern on a laser-transparent repair carrier substrate ( 707 ); aligning the micro-LEDs ( 703 b ) on the repair carrier substrate ( 707 ) with defect positions on the receiving substrate, and bringing the micro-LEDs ( 703 b ) into contact with pads at the defect positions; and irradiating the repair carrier substrate with a laser from the repair carrier substrate side, to lift-off the micro-LEDs from the repair carrier substrate ( 707 ).

First claim

What is claimed is:

1. A method for repairing micro-LED defects, the method comprising the steps of:
obtaining micro-LED defect pattern on a receiving substrate;
forming micro-LEDs corresponding to the defect pattern on a laser-transparent repair carrier substrate;
aligning the micro-LEDs on the repair carrier substrate with the defect positions on the receiving substrate, and bringing the micro-LEDs into contact with the pads at the defect positions; and
irradiating the repair carrier substrate with laser from the repair carrier substrate side, to lift-off the micro-LEDs from the repair carrier substrate.

2. The method according to claim 1 , wherein the step of forming micro-LEDs corresponding to the defect pattern comprises:
mounting the micro-LEDs onto a temporary substrate in the defect pattern; and
transferring the micro-LEDs on the temporary substrate to the repair carrier substrate.

3. The method according to claim 2 , wherein:
an adhesive is coated on the temporary substrate, and
the step of mounting the micro-LEDs onto a temporary substrate comprises:
bringing micro-LEDs on a laser-transparent original substrate into contact with the adhesive;
irradiating the original substrate with laser in the defect pattern, to lift-off the micro-LEDs from the original substrate; and
keeping the lifted-off micro-LEDs in the defect pattern on the temporary substrate while releasing the un-lifted-off micro-LEDs through a partial adhesive releasing.

4. The method according to claim 3 , wherein the step of transferring the micro-LEDs on the temporary substrate to the repair carrier substrate comprises:
bonding the micro-LEDs on the temporary substrate onto the repair carrier substrate; and
lifting-off the micro-LEDs from the temporary substrate through a complete adhesive releasing.

5. The method according to claim 4 , wherein:
the micro-LEDs on the temporary substrate are bonded onto the repair carrier substrate through a polymer thin film, and
at least one part of the polymer thin film is removed after the micro-LEDs is lifted-off from the temporary substrate.

6. The method according to claim 3 , wherein:
the adhesive is a UV tape, and
the temporary substrate is a PET plate.

7. The method according to claim 4 , wherein the partial adhesive releasing and the complete adhesive releasing are performed through UV exposure.

8. The method according to claim 7 , wherein:
the exposure time or energy used in the partial adhesive releasing is less than a standard exposure time or energy, and
the exposure time or energy used in the complete adhesive releasing is higher than or equal to the standard exposure time or energy.

9. The method according to claim 1 , wherein the repair carrier substrate is a sapphire substrate.

10. A method for manufacturing a micro-LED device, said method comprising the step of repairing micro-LED defects on a receiving substrate by using the method according to claim 1 .

11. A micro-LED devicenmanufactured by using the method according to claim 10 .

12. An electronic apparatus, containing a micro-LED device according to claim 11 .

Assignees

• Goertek Inc
• Goertek Inc

Inventors

• Zou Quanbo
• Wang Zhe

Classifications

• H10W74/142

  the encapsulations exposing the passive side of the semiconductor body · CPC title

• H10W72/0198

  batch processes · CPC title

• H10W90/00

  Package configurations · CPC title

• H10W72/074

  of anisotropic conductive adhesives · CPC title

• H10W72/073

  of die-attach connectors · CPC title