Lead-free solder ball

Patent metadata

Field	Value
Publication number	US-9780055-B2
Application number	US-201214409412-A
Country	US
Kind code	B2
Filing date	Jun 30, 2012
Priority date	Jun 30, 2012
Publication date	Oct 3, 2017
Grant date	Oct 3, 2017

Abstract

A lead-free solder ball is provided which suppresses interfacial peeling in a bonding interface of a solder ball, fusion defects which develop between the solder ball and solder paste, and which can be used both with Ni electrodes plated with Au or the like and Cu electrodes having a water-soluble preflux applied atop Cu. The lead-free solder ball for electrodes of BGAs or CSPs consists of 1.6-2.9 mass % of Ag, 0.7-0.8 mass % of Cu, 0.05-0.08 mass % of Ni, and a remainder of Sn. It has excellent resistance to thermal fatigue and to drop impacts regardless of the type of electrodes of a printed circuit board to which it is bonded, which are Cu electrodes or Ni electrodes having Au plating or Au/Pd plating as surface treatment. The composition may include at least one element selected from Fe, Co, and Pt in a total amount of 0.003-0.1 mass % or at least one element selected from Bi, In, Sb, P, and Ge in a total amount of 0.003-0.1 mass %.

First claim

The invention claimed is:

1. A lead-free solder ball which is installed for use as an electrode on a rear surface of a module substrate for a BGA or a CSP, the solder ball having a solder composition consisting of:
1.6-2.9 mass % of Ag,
0.7-0.8 mass % of Cu, 0.05-0.08 mass % of Ni, and
a remainder of Sn.

2. A lead-free solder ball as set forth in claim 1 , wherein the solder composition consists of:
1.9-2.3 mass % of Ag,
0.7-0.8 mass % of Cu,
0.05-0.08 mass % of Ni, and
a remainder of Sn.

3. A lead-free solder ball as set forth in claim 1 , wherein the solder ball has a diameter of at least 0.1 mm.

4. A lead-free solder ball as set forth in claim 1 , wherein the solder ball has a diameter of at least 0.3 mm.

5. A lead-free solder ball as set forth in claim 1 , wherein the solder ball has a diameter of at least 0.5 mm.

6. A method of forming solder bumps on a module substrate having electrodes selected from electrolytic Ni/Au electrodes, electroless Ni/Pd/Au electrodes, and Cu—OSP electrodes, wherein soldering is performed using a solder ball as set forth in claim 1 .

7. A lead-free solder ball as set forth in claim 1 , wherein the lead-free solder ball develops zero occurrence of fusion defects in a test for fusion defects.

8. A module substrate for a BGA or a CSP comprising the lead-free solder ball of claim 1 .

9. A module substrate for a BGA or a CSP comprising the lead-free solder ball of claim 2 .

10. An electronic part comprising a module substrate for a BGA or a CSP mounted on a printed circuit board and the lead-free solder ball of claim 1 .

11. An electronic part comprising a module substrate for a BGA or a CSP mounted on a printed circuit board and the lead-free solder ball of claim 2 .

Assignees

• Yamanaka Yoshie
• Tachibana Ken
• Yoshikawa Shunsaku
• NOMURA Hikaru
• Senju Metal Industry Co

Inventors

• Yamanaka Yoshie
• Tachibana Ken
• Yoshikawa Shunsaku
• NOMURA Hikaru

Classifications

• H10W72/29

  Bond pads specially adapted therefor · CPC title

• H10W72/952

  comprising metals or metalloids, e.g. PbSn, Ag or Cu · CPC title

• H10W72/923

  Bond pads having multiple stacked layers · CPC title

• H10W72/012

  of bump connectors, dummy bumps or thermal bumps · CPC title

• H10W72/252

  comprising solid metals or solid metalloids, e.g. PbSn, Ag or Cu · CPC title